Q

Quantinuum

Full-stack quantum hardware and software solutions

Lead/Principal Semiconductor Packaging Engineer

Hardware Systems IntegrationUpdated on Nov 7
Full-timeMalta, NY, USA

About the Job

Requirements

  • A Bachelor's degree and 10 or more years of experience, or a Master's degree and 8 or more years of experience, or a PhD and 6 or more years of experience in advanced semiconductor packaging development.
  • Experience with 2.5D–3D packaging techniques.
  • Must be a U.S. Person, defined as a U.S. citizen, permanent resident or green card holder, or worker granted asylum or refugee status.

Responsibilities

  • Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips, and optical chips together.
  • Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density.
  • Generate packaging requirements for mechanical, thermal, electrical, and optical performance.
  • Lead a team working with vendors to implement and validate packaging processes.
  • Support all stages of ion trap development to ensure compatibility with packaging.
  • Lead a team of packaging engineers to interface with the broader Quantinuum team to ensure ion trap packaging meets system requirements.
  • Champion engagements with third parties to cultivate key partnerships, supplier relationships, and co-development opportunities.

Desired Qualifications

  • PhD in Physics or Engineering.
  • Experience with advanced large-area multi-chip semiconductor packaging technologies.
  • Experience with large heterogeneous integration.
  • Experience with high-density I/O technologies.
  • Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling.
  • A proven track record of innovation and intellectual property development.
  • Experience working within a cross-functional team environment.

About the Company

Quantinuum

Full-stack quantum hardware and software solutions

Quantinuum provides both quantum hardware and software. Its H1-1 processor runs quantum circuits, while TKET is an open-access, architecture-independent software stack that lets developers design circuits that work across different quantum devices. It differs from competitors by delivering quantum-hardened encryption keys at the device level and offering a complete hardware-software package, plus it has demonstrated strong performance by passing the Quantum Volume 32,768 benchmark. Its goal is to help solve real-world problems like drug discovery, new materials design, and supply-chain optimization while keeping data secure against evolving quantum threats.

Company size
501-1,000
Company stage
IPO
Headquarters
Broomfield, CO
Founded
2021

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