Lyte AI

Robotics perception platform with silicon-level fusion

Assembly and Packaging Process Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeNo salary listedRemote

About the Job

Requirements

A bachelor's degree and at least 1 year of experience are required.
English communication capability is required.
Experience or knowledge of printed circuit board assembly with a surface-mount technology line is required.
Hands-on experience in laboratory experimentation and data analysis is required.
Familiarity with Microsoft Office is required.
Ability to maintain company confidential information is required.

Responsibilities

Work with outsourced semiconductor assembly and test providers in Asia to support company device packaging process improvements for new product introduction and volume manufacture.
Work with contract manufacturers in Asia to support optical engine and subcomponent assembly and process improvements for new product introduction and volume manufacture.
Track projects weekly.
Write technical reports and present results.
Analyze data and track process capability (Cp and Cpk) at outsourced semiconductor assembly and test providers, assembly houses, and contract manufacturers for internal use.
Support component-level, device-level, optical engine, and module system assembly tests and reliability work.
Maintain software and firmware support for testing and relevant setups.

Desired Qualifications

A higher degree and more experience are highly desired.
Experience with microelectronic device packaging.
Previous experience with optical device packaging.
Hands-on testing experience with photonic and electronic devices or components.
Device test knowledge and experience in some of the following areas: III-V chip-on-carrier, wafer-level probe testing, packaged electro-optical devices, assembly modules, or printed circuit board assembly.
Knowledge and experience in some of the following processes: III-V or CMOS wafer-level processing; III-V bar-level processes; device packaging processes such as die attach, flip chip, and wire bonding; and module mechanical assembly processes, particularly camera and lidar module assembly.
Experience with SolidWorks and familiarity with engineering drawings.
Data analysis experience with JMP; Excel experience is acceptable.
Programming and software maintenance skills, such as Python or C++.
Understanding of microelectronic and mechanical reliability tests.
Experience in microsystem assembly, such as hard disk assembly.

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

What you'll do

Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
Project tracking weekly.
Write technical reports and present results.
Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
Maintain the software and firmware support for testing and relevant setups.

Required Qualifications

Minimal requirement is a bachelor's degree with 1 years of experience.
The successful candidate need have English communication capability.
Experience or knowledge of PCB assembly with SMT line
Hands-on experience in laboratory experimentation and data analysis
English communication capability is a must.
Familiar with Microsoft Office.
Fast learner is a must.
Good work ethics and Maintain company confidential information are a must

Preferred Qualifications

Higher degree with more experience is highly desired.
Experience with microelectronic device packaging.
Former experience of optical device packaging is highly desirable.
Experience with hands-on testing of photonic and electronic. device/components.
Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
Experience in SolidWorks and familiar with Engineering drawing is a plus.
Data analysis experience such as JMPs is a plus; excel is OK.
Programming and software maintenance skills are desired eg. python, or C++
Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
Experience in microsystem assembly such as hard disk assembly is a plus.

Benefits (subject to location and local regulations)

Competitive salary and equity
Flexible vacation and time-off policy
Collaborative, fast-paced, and inclusive work environment
Opportunity to work on cutting-edge technologies with a highly cross-functional team

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size: 51-200
Company stage: Series C
Total funding: $272M
Headquarters: Mountain View, CA
Founded: 2021

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