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MaxLinear

Fabless RF/analog/mixed-signal IC designer

Senior Principal PCI Express Physical Layer Signal & Power Integrity Engineer

Hardware Validation & TestingPosted on Nov 5
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Extensive hands-on experience validating PCIe PHYs or high-speed SerDes interfaces at silicon, board, or system level.
  • Practical lab expertise with high-bandwidth oscilloscopes, BERTs, protocol analyzers, compliance software, pattern generators, VNAs/TDRs, differential probes, and precision clock/jitter measurement equipment.
  • Experience with PCIe electrical concepts such as eye margin, jitter decomposition, transmitter presets, receiver equalization, CTLE, DFE, de-emphasis, SSC, reference clock quality, channel loss, crosstalk, and compliance masks.
  • Ability to debug complex interactions across PHY settings, firmware, BIOS, host platforms, add-in cards, retimers/redrivers, connectors, cables, board layout, power delivery, and thermal conditions.
  • Strong data analysis and automation skills using Python, lab instrument APIs, register access scripts, log parsing, and structured result reporting.
  • Ability to lead cross-functional engineering debug, make technically grounded recommendations, and communicate with design, firmware, systems, SI/PI, manufacturing, and leadership teams.

Responsibilities

  • Define validation plans for PCIe PHY electrical characterization, compliance readiness, interoperability, margining, and stress testing across silicon and board revisions.
  • Translate PCIe Base/CEM requirements and platform use cases into executable lab tests, pass/fail criteria, and risk-based validation coverage including DVT and PVT phases.
  • Characterize transmitter, receiver, reference clock, reset, link equalization, lane margining, and high-speed channel behavior using high-bandwidth oscilloscopes, BERTs, pattern generators, protocol analyzers, and compliance test tools.
  • Analyze eye diagrams, jitter, equalization behavior, presets, CTLE/DFE settings, SSC impact, de-emphasis, insertion loss, return loss, crosstalk, and channel margin under realistic system conditions.
  • Use simulation platforms to predict, analyze, and optimize system performance before hardware is built.
  • Architect and implement high-speed interface designs, including PCIe Gen5/6 and OCP-compliant protocols for PCIe HHHL, OCP 3.0 NIC, and EDSFF form-factor boards for high-volume production.
  • Debug link training and stability issues using LTSSM analysis, firmware logs, register dumps, protocol traces, electrical captures, and controlled experiments.
  • Isolate PHY, board, package, connector, retimer/redriver, reference clock, reset, power, firmware, BIOS, and host-platform contributors to failure signatures.
  • Plan and execute PCIe compliance-oriented testing, including transmitter/receiver characterization, stressed conditions, interoperability runs, and failure reproduction ahead of external compliance events.
  • Work with internal and external labs, ecosystem partners, and platform teams to close compliance gaps with data-driven recommendations.
  • Support Functional Circuit Test (FCT) and In-Circuit Test (ICT) processes.
  • Support key customers through product ramps.
  • Lead RMA analysis and work with customers and manufacturing teams to resolve board-level issues.
  • Mentor engineers, review validation plans and results, lead difficult technical investigations, and communicate risks, tradeoffs, and recommendations to engineering leadership.

Desired Qualifications

  • Working knowledge of high-speed channel modeling, S-parameters, insertion/return loss, package/board effects, and correlation between simulation and measurement.
  • Experience with Linux-based bring-up, low-level register debug, firmware-controlled PHY tuning, diagnostic utilities, and production validation flows.
  • Background in signal integrity/power integrity (SI/PI) to connect measured PHY behavior, channel design, and board/package implementation.
  • PCB and package layout expertise using Cadence Allegro, APD, or similar tools.
  • Familiarity with IC floor planning, EM/IR analysis, and advanced silicon-package-system co-design methodologies.

About the Company

MaxLinear

Fabless RF/analog/mixed-signal IC designer

MaxLinear designs and sells RF, analog, and mixed-signal ICs for broadband, connectivity, infrastructure, and industrial markets. It offers system-on-chip solutions for cable broadband, fiber-to-the-home networks, and Wi-Fi, plus RF transceivers and high-speed interconnects for data centers, set-top boxes, automotive video systems, and mobile devices. It is a fabless company that outsources manufacturing to foundries like UMC and targets OEM, ODM, and module makers, expanding its portfolio through acquisitions such as Exar, Intel’s Home Gateway Platform Division, and NanoSemi. Its goal is to provide scalable, high-quality semiconductor solutions that enable reliable connectivity across home, mobile, automotive, and data-center applications, while growing through diversified products and strategic acquisitions.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Carlsbad, CA
Founded
2003

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