Engineer 1 Process Grinding and Lamination

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Job Description:

The Engineer I-Process – Backgrind is responsible for the development, characterization, qualification, and industrialization of wafer thinning technologies supporting advanced semiconductor packaging platforms including WLCSP, BGA, MDQFN, Fan-Out, and other wafer-level packaging technologies. The role focuses on developing robust backgrinding, wafer thinning, stress management, and wafer handling processes that enable high-yield, reliable, and manufacturable products.

The position serves as the technical lead for Backgrind process development activities, driving technology innovation, new product introduction (NPI), process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.

Job Responsibilities:

• Lead the development and qualification of wafer backgrinding and thinning processes for new technology platforms and products.
• Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
• Drive innovation initiatives to enable thinner wafers, improved wafer integrity, and advanced package requirements.
• Evaluate and implement new grinding technologies, materials, consumables, and equipment solutions.
• Develop best practices and standards for wafer thinning and handling operations
• Define process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.
• Lead process characterization activities to establish robust operating windows and process margins.
• Evaluate emerging technologies, materials, and equipment to enhance technical capabilities and competitive advantage.
• Drive innovation initiatives to improve metallization performance, process capability, throughput, and cost effectiveness.
• Lead process transfer from development to pilot and high-volume manufacturing.
• Generate process specifications, control plans, operating procedures, and qualification reports.
• Ensure developed processes meet manufacturability, reliability, and cost targets.
• Support manufacturing teams during technology ramp and early production phases.
• Drive process stabilization and continuous improvement following production release.
• Serve as Subject Matter Expert (SME) for:
  • Wafer and Panel Backgrinding
  • Top mold grinding
  • Coarse and Fine Grinding
  • Wafer Thinning Technologies
  • Temporary Wafer Mounting Systems
  • Grinding Wheel Technologies
  • Wafer or Panel Handling and Transport
  • Wafer or Panel Warpage Management
  • Thin Wafer Processing
  • Tape Lamination, Detaping and Cure Processes

Requirements/Qualifications:

• Bachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, Related Engineering disciplines
• Minimum 3 years of semiconductor manufacturing experience with direct experience in Backgrinding and Tape Lamination process
• Engineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR and Six Sigma tools
• Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Strong experience with Fan-in and Fan-Out or advanced packaging tools is highly preferred
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills
• Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability

Travel Time:

0% - 25%

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