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Powerlattice

Integrated power-delivery chiplet for compute

Senior/Staff Analog IC Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-time

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Science, or a related field.
  • At least 5 years of hands-on analog design experience.
  • A strong foundation in analog circuit theory, device physics, and CMOS technologies.
  • Experience designing common analog blocks such as bandgaps, LDOs, oscillators, op-amps, ADCs, and DACs.
  • Ability to carry designs from specification through schematic, simulation, layout guidance, and post-layout verification.
  • Proficiency with industry-standard electronic design automation tools such as Cadence.
  • Experience with DC, AC, transient, noise, and corner simulations.
  • Working knowledge of reliability, mismatch, and layout-dependent effects.
  • Hands-on laboratory experience, including silicon bring-up, bench characterization, and debugging of analog/mixed-signal integrated circuits.

Responsibilities

  • Design and develop core analog and mixed-signal circuit blocks, including bandgap references, oscillators, LDOs, op-amps, ADCs, and DACs.
  • Translate system- and block-level specifications into robust circuit architectures and implementations.
  • Perform schematic capture, simulation, and optimization to meet performance, power, area, and reliability targets.
  • Provide layout guidance and collaborate with layout engineers to ensure design intent is met.
  • Perform post-layout (PEX) simulations and correlate results with pre-layout analysis.
  • Participate in design reviews and contribute to clear, thorough design documentation.
  • Support silicon bring-up, block-level evaluation, characterization, and debugging.
  • Apply best practices for analog design, verification, and sign-off.

Desired Qualifications

  • Experience with deep submicron CMOS process technologies.
  • Familiarity with high-power or high-accuracy analog design techniques.

About the Company

Powerlattice

Integrated power-delivery chiplet for compute

PowerLattice develops power delivery chiplets that sit in the processor package to provide voltage regulation directly at the compute die. The chiplet packages miniaturized on-die inductors, voltage control circuits, a vertical packaging design, and a programmable software layer on a single silicon die to move power delivery closer to the compute core. This near-die integration differs from typical power management by delivering regulatory functions inside the chiplet itself, enabling substantial energy savings and easier scaling across AI accelerators, GPUs, and data-center CPUs. The goal is to improve efficiency and performance for next-generation compute by offering modular, near-die power regulation to hyperscalers, OEMs, and system integrators, with early sampling and trials planned for 2026.

Company size
11-50
Company stage
Late Stage VC
Total funding
$111M
Headquarters
Vancouver, WA
Founded
2023

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