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MaxLinear

Fabless RF/analog/mixed-signal IC designer

Applications Engineering Manager - Hardware & Optical Products

Engineering LeadershipPosted on Nov 5
Full-timeHsinchu, North District, Hsinchu City, TaiwanNo salary listed

About the Job

Requirements

  • This position requires an Application Engineer Team Leader with 3+ years of experience.
  • A Bachelor of Science or Master of Science in Electrical Engineering is required, along with 6+ years of optical module experience involving long-haul or data-center transceiver product design.
  • Broad knowledge of analog circuits and system hardware integration, firmware, and software issues at the application layer is required.
  • Experience in high-speed digital and radio-frequency/microwave printed circuit board design is required.
  • Familiarity with laboratory instruments, including spectrum analyzers, signal generators, network analyzers, digital communication analyzers, optical/electrical clock recovery, logic analyzers, protocol analyzers, and bit error rate testers, is required.
  • Strong leadership to lead optical hardware systems applications engineers is required.
  • The candidate must drive customer issues to closure and act as the interface between customers and internal engineering to resolve technical issues.
  • The candidate must write and maintain datasheets, technical application notes, and user guides, and be capable of guiding customers through product usage.
  • Excellent verbal and written communication skills in English are required.
  • The candidate must be self-motivated and have a strong sense of ownership.
  • The candidate must work well under pressure and learn quickly in a fast-paced environment.
  • The candidate must be able to address technical and business challenges.
  • The role requires up to 30% travel to support partners and customers on site.

Responsibilities

  • Lead the Optical Hardware Systems Applications Engineers.
  • Hire and mentor the hardware team.
  • Lead technical discussions with internal teams and customers.
  • Prepare the annual resource plan and hardware budget plan for AOP.
  • Work with regional Sales and FAE teams to secure design wins and strengthen relationships with key customers and strategic partners.
  • Communicate and clarify customer system specifications and application requirements.
  • Demonstrate MaxLinear products and present technical seminars at customer sites.
  • Support and track customer design, commissioning, validation, and debugging activities.
  • Provide product and technical training to regional sales and FAE teams, and support customer and FAE training.
  • Reproduce customer issues and complete primary debugging.
  • Assist with regression and stress testing.
  • Assist with the RMA chip bench test.
  • Perform feasibility studies for new product features.
  • Support the marketing team in defining new products and roadmaps.
  • Carry out competitive intelligence studies and analysis.
  • Create reference designs for system validation and customer evaluation.
  • Develop product test plans and produce test reports.
  • Produce product collateral and customer support documents, including application notes, datasheets, and user guides.
  • Perform field testing and analysis for new products.
  • Work with engineering teams to improve product reliability, quality, and user experience.
  • Manage and support PCB and assembly vendors to purchase parts and build PCBs and PCBAs.
  • Manage, test, and deliver EVKs to FAEs or customers.

Desired Qualifications

  • Experience with RF/SI simulation tools such as ADS or HFSS is a plus.
  • Experience designing 400G/800G/1.6T transceivers using DML, EML, SiPho driver/TIA/CDR/DSP/PAM4, including circuit design, hardware/software debugging, and application support, is preferred.
  • Driver integration and ATE development experience for platform characterization and debugging is a plus.

About the Company

MaxLinear

Fabless RF/analog/mixed-signal IC designer

MaxLinear designs and sells RF, analog, and mixed-signal ICs for broadband, connectivity, infrastructure, and industrial markets. It offers system-on-chip solutions for cable broadband, fiber-to-the-home networks, and Wi-Fi, plus RF transceivers and high-speed interconnects for data centers, set-top boxes, automotive video systems, and mobile devices. It is a fabless company that outsources manufacturing to foundries like UMC and targets OEM, ODM, and module makers, expanding its portfolio through acquisitions such as Exar, Intel’s Home Gateway Platform Division, and NanoSemi. Its goal is to provide scalable, high-quality semiconductor solutions that enable reliable connectivity across home, mobile, automotive, and data-center applications, while growing through diversified products and strategic acquisitions.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Carlsbad, CA
Founded
2003

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