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Lyte AI

Robotics perception platform with silicon-level fusion

Systems Engineer - Module Integration

Hardware Systems IntegrationUpdated on Nov 15
Full-timeSunnyvale, CA, USA

About the Job

Requirements

  • A Master's or PhD degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, or a related field.
  • At least 5 years of hands-on systems, hardware, or integration engineering on a physical product.
  • Experience carrying at least one hardware product through prototype, engineering builds, and production ramp, including addressing problems at each stage.
  • Strong laboratory skills and the ability to use instrumentation and debug issues spanning hardware, firmware, and software.
  • Working knowledge of failure analysis, structured root-cause methods, non-destructive-first triage, corrective action, and reasoning from test and component data.
  • Familiarity with hardware productization processes, including bill of materials and change control, travelers and work instructions, incoming and outgoing quality control, end-of-line testing, yield and DPPM, calibration, serialization, and traceability.
  • Python skills for test automation and data analysis.
  • Ability to work across optics, electronics, mechanics, and software without needing to be the deepest expert in any one area.
  • Clear technical writing and ability to work across teams that do not report to the role.
  • Willingness to travel to manufacturing and vendor sites as builds require.

Responsibilities

  • Own module-level integration, bringing subsystems together, making them work as a product, and debugging problems that emerge when they are combined.
  • Translate product requirements into quantifiable module specifications and ensure those specifications flow down coherently to subsystem teams.
  • Drive system bringup for new hardware, including new silicon, PCBAs, optics, and thermal designs, and make new configurations run end to end.
  • Plan and execute engineering builds in-house and at contract manufacturers, and own the readiness criteria that gate them.
  • Define test coverage, KPIs, and pass/fail limits across component, subsystem, and module levels, and assess whether data across those levels agrees.
  • Contribute to early concept work and in-house prototyping for next-generation products before a program formally begins.
  • Participate in failure analysis and root-cause investigations on prototype, production, and field units.
  • Work directly with optics, electrical, mechanical, silicon, firmware, and software teams.
  • Support customer engineering by understanding customer requirements and module deployment, and feeding that information into product and test decisions.

Desired Qualifications

  • Experience with new product introduction and engineering builds at contract manufacturers.
  • Experience defining, deploying, and correlating test stations.
  • Experience defining requirements and flowing specifications down across a multi-team hardware program.
  • Experience with concept prototyping and bringing up new silicon or board designs at the earliest stage of a program.
  • Experience managing EVT/DVT/PVT cycles and production ramp.
  • Exposure to LiDAR, cameras, optics, or precision opto-mechanical systems.
  • Ability to operate effectively in a startup environment with ambiguity, speed, and high ownership.

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size
51-200
Company stage
Series C
Total funding
$272M
Headquarters
Mountain View, CA
Founded
2021

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