Equipment Engineering Maintenance Section Leader

Job Summary: 

onsemi is currently seeking an  Equipment Engineering Maintenance Section Leader to support our Site in Mountain Top, PA!

As an Equipment Engineering Maintenance Section Leader at onsemi, you will manage a team of Equipment Maintenance Technicians responsible for 24x5 manufacturing of wafers used in Automotive and Consumer applications throughout the world. In this team based environment, you will work closely with the Fab Operations Group to provide equipment that supports the overall site goals. 

• 3-5 years of experience demonstrating improving department performance as a Semiconductor Process Engineer or Equipment Engineer.
• Management experience required.
• Bachelor’s Degree in Engineering or Physical Science is required.
• Experience in a manufacturing environment required.
• Organized, detail oriented individual able to succeed in a team based environment.
• Proven history of leading teams to improve yield, cost, and cycle time and equipment performance.
• Strong communicator, who can effectively engage a team of fabrication specialists, technicians and engineers to work toward overall department improvement. 
• Self-starter, who drives projects to completion in a time sensitive, fast paced manufacturing environment.
• Strong understanding of statistical software, experimental design and yield management software. 

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In this role, you will have an opportunity to:

• Lead a team of technicians in a fast paced manufacturing environment.
• Work with international counterparts to benchmark best known maintenance practices to improve overall site performance.
• Drive cost cutting opportunities and work on improving the overall tool uptime.

Within the first two months:

• You will determine the most significant improvement activities with respect to yield, cost, and cycle time and equipment performance.  
• You will then establish action plans for your team to drive continuous improvement in these areas. 

Within the first six months:

• You will be expected to demonstrate measurable progress improving the areas’ performance in support of the site metrics. 

The specific functional area assignment will be directed towards Implant, Wafer thin, Metals, Sort, and Diffusion