onsemi

Semiconductors for intelligent power and sensing

Integration Engineer - BCD Technology

Process EngineeringConfirmed live in the last 24 hours

Full-timeHopewell Junction, NY, USA$127.8k - $217k /yrIn-person

About the Job

Requirements

A Bachelor of Science or higher degree in Engineering or Materials Science.
Two to four or more years of relevant experience in semiconductor manufacturing integration and technology development.
Familiarity with 5S, 8D, Six Sigma, statistical process control, design of experiments, and failure mode and effects analysis.
Demonstrated experience with back-end-of-line process integration, including MIM capacitors, copper metallization, chemical mechanical planarization, dielectric integration, or related back-end-of-line modules.
Familiarity with post-fabrication process considerations such as probe, backgrind, backside metallization, or packaging interfaces as they relate to technology qualification and manufacturability.
Strong technical judgment and the ability to drive complex, cross-module integration decisions with limited precedent.
Experience working in or alongside advanced 300-millimeter semiconductor manufacturing environments.

Responsibilities

Work across device, process, and integration disciplines to deliver advanced BCD technologies from concept through qualification and readiness for volume manufacturing.
Drive new technology development while ensuring that technologies are robust, manufacturable, and production-ready.
Perform yield learning, reliability activities, process-window definition, tooling readiness, and defectivity control.
Manage complex interactions across highly coupled process flows spanning multiple modules and stakeholders.
Drive complex technical issues to closure in an advanced manufacturing environment.
Drive high-voltage BCD platform enhancements from development through qualification and manufacturing readiness.
Integrate embedded non-volatile memory modules into an established BCD technology.
Enable ROIC-optimized process flows and advanced MIM capacitor options, including integration and manufacturability trade-offs within a complex back-end-of-line stack.
Develop low-power and low-noise CMOS options for sensitive analog and imaging applications.
Improve DMOS performance and reliability through targeted device and process integration changes, with emphasis on qualification and manufacturability.
Support packaging and post-fabrication readiness using standardized test vehicles to accelerate technology qualification.

onsemi is seeking a Technology BCD Integration Engineer in our Hopewell Junction, NY, site. Engineers on this team work across device, process, and integration disciplines to deliver advanced BCD technologies from concept through qualification and readiness for volume manufacturing. In addition to driving new technology development, team members are responsible for ensuring the technology is robust, manufacturable, and production‑ready, including yield learning, reliability, process window definition, tooling readiness, defectivity control, and managing complex interactions across highly coupled process flows that often span multiple modules and stakeholders.

You’ll thrive in this role if you enjoy working at the intersection of technology development and manufacturing readiness, are comfortable navigating trade‑offs across integrated device and process modules, and take ownership of driving complex technical issues to closure in an advanced manufacturing environment.

Preferred Qualifications

Education: BS or higher degree in Engineering or Materials Science
Experience: 2-4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
Demonstrated experience with back‑end‑of‑line (BEOL) process integration, including areas such as MIM capacitors, copper metallization, CMP, dielectric integration, or related BEOL modules.
Familiarity with post‑fab process considerations (e.g., probe, backgrind, backside metallization, or packaging interfaces) as they relate to technology qualification and manufacturability.
Strong technical judgment and ability to drive complex, cross‑module integration decisions with limited precedent.
Experience working in or alongside advanced 300 mm semiconductor manufacturing environments.

Salary: onsemi is excited to share the base salary range for this position is$127,800 to $217,000 exclusive of fringe benefits or potential bonuses.The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

This role sits at the critical intersection between technology development and manufacturing readiness. The work you do directly determines whether new BCD platforms successfully transition from promising concepts into reliable, scalable technologies that enable next‑generation products across power, automotive, industrial, and imaging markets. Strong execution in this role accelerates time‑to‑market, reduces downstream risk, and sets the foundation for success at onsemi’s most advanced fab.

Representative Projects May Include

Driving high‑voltage BCD platform enhancements from development through qualification and manufacturing readiness.
Integrating embedded non‑volatile memory modules into an established BCD technology.
Enabling ROIC‑optimized process flows and advanced capacitor (MIM) options, including integration and manufacturability trade‑offs within a complex BEOL stack.
Developing low‑power and low‑noise CMOS options to improve performance in sensitive analog and imaging applications.
Improving DMOS performance and reliability through targeted device and process integration changes, with emphasis on qualification and manufacturability.
Supporting packaging and post‑fab readiness using standardized test vehicles to accelerate technology qualification.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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