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Applied Materials

Builds equipment for chip and display factories

Account Technologist - PVD Advanced Packaging

Implementation & Technical Account ManagementPosted on Nov 10
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Materials Science, Physics, Chemical Engineering, or a related field is required; a PhD is preferred.
  • At least 10 years of experience in semiconductor equipment or process engineering, with strong PVD experience in advanced packaging, including FO-WLP, 2.5D/3D, and RDL/UBM.
  • Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Responsibilities

  • Act as the technical owner for PVD solutions at assigned OSAT and Fabless accounts, aligning design requirements with manufacturing processes.
  • Understand customers' and Fabless stakeholders' technical roadmaps.
  • Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows, and translate them into executable OSAT solutions.
  • Lead joint qualification programs involving Fabless and OSAT stakeholders by defining success metrics, design of experiments, and acceptance gates, and managing execution to schedule.
  • Establish process-of-record for advanced packaging applications, including RDL barrier/seed, TSV liners, and hybrid bonding underlayers.
  • Drive tool acceptance (FAT/SAT) and high-volume manufacturing ramp at OSAT sites, including SPC setup, chamber matching, defectivity control, and yield stabilization.
  • Validate PVD film integrity under Fabless-driven reliability tests using JEDEC/IPC standards, including electromigration, time-dependent dielectric breakdown, and thermal cycling.
  • Coordinate with Product Engineering, Field Service, and Quality teams to deliver solutions tailored to OSAT and Fabless needs.
  • Resolve integration challenges across packaging flows, including ESD, adhesion, contamination, and stress, using structured problem-solving.
  • Lead structured root-cause analysis on yield or reliability excursions, implement corrective actions, and verify effectiveness.
  • Provide feedback to internal engineering on hardware and process enhancements based on OSAT and Fabless requirements.

Desired Qualifications

  • Experience enabling hybrid bonding or chiplet integration through PVD underlayers.
  • Familiarity with the APAC OSAT ecosystem and Fabless packaging roadmaps.
  • Proficiency in statistical process control, design of experiments, metrology, and yield analytics.
  • Expertise in thin-film metallurgy, including Cu, Ni, Ti, Ta/TaN, and Co, and reliability-critical stack design.
  • Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

About the Company

Applied Materials

Builds equipment for chip and display factories

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1967

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