K

Kandou AI

Provides chip-to-chip AI connectivity solutions

Staff Engineer - Embedded SoC Firmware, DDR Memory controller

Embedded EngineeringConfirmed live in the last 24 hours
Full-timePune, Maharashtra, IndiaNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Electrical Engineering or Computer Science is required; a Master's degree is preferred.
  • A minimum of 8–15 years of experience developing firmware for servers, memory controllers, and DDR PHY programming.
  • Hands-on experience designing and developing embedded firmware for DDR memory controller, PCIe, or NVMe protocols, with proficiency in C or C++ and development of C-based software development kits.
  • Experience with bare-metal and RTOS/Zephyr OS firmware development and enablement.
  • Familiarity with SoC interfaces to common IP blocks, including PCIe controllers, NVMe controllers, DDR controllers, AMBA/AHB interfaces, and on-chip memory interfaces.
  • Experience developing firmware for DRAM/DDR controllers using bare-metal or RTOS approaches.

Responsibilities

  • Develop firmware modules and services for the company’s memory fabrics products with DDR interfaces.
  • Implement and support the major differentiating features of the company’s products.
  • Work with cross-functional groups, including architects, development teams, QA/validation, product management, and customer teams across various sites.

Desired Qualifications

  • Experience with storage or SSD firmware, including NVMe, PCIe, CXL, or flash management concepts.
  • Hands-on experience with simulation or virtual-platform-based development, such as Renode or QEMU.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

Recently Posted Jobs

Explore more opportunities at Kandou AI

See more jobs