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Applied Materials

Builds equipment for chip and display factories

Process Support Engineer - Inline 3D X-ray

Full-TimeUpdated on 10/23/2026
No salary listed
Entry, Junior, Mid
Bachelor's, Master's, PhD
Shanghai, China
In PersonTravel to customer sites and company headquarters in California as needed.
Field ServiceEquipment Field Service

About the job

Requirements
  • A bachelor's degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics, or a related field.
  • Two to four years of experience in the semiconductor fab or equipment industry.
  • Communication proficiency in English.
  • A bachelor's degree or higher in a technical discipline such as physics, applied physics, solid state physics, materials science, materials engineering, electrical or electronics engineering, mechanical engineering, chemical engineering, chemistry, physical chemistry, microelectronic engineering, or nanotechnology, or a related field.
  • Strong analytical and problem-solving skills, including the ability to work methodically through complex hardware and software issues.
  • Ability to work independently and collaboratively and manage relationships with internal teams and customer stakeholders.
  • Customer service skills and internal and external networking ability.
  • Ability to work under pressure and manage moderately complex projects from planning through execution.
  • Motivation, a strong work ethic, and financial awareness.
  • Written and verbal communication skills in Mandarin and English.
  • Comfort working in Linux and Windows operating environments.
  • Willingness to travel to company headquarters in California and additional customer sites as needed.
  • Adherence to health and safety requirements at customer sites.
Responsibilities
  • Provide customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment.
  • Work with customers to develop processes used to manufacture advanced semiconductor chips.
  • Create hypothesis experiments and design of experiments; analyze data with statistics; and compile reports with conclusions on process engineering experiments.
  • Troubleshoot complex problems, perform root cause analyses, and resolve process engineering and customer product issues.
  • Communicate with internal stakeholders and customers to achieve goals and establish trusted working relationships.
  • Apply knowledge of company processes and customers to solve problems and analyze possible solutions.
  • Travel to customer fabs to provide on-site technical support for the inline 3D X-ray inspection tool, with guidance from senior X-ray scientists.
  • Troubleshoot and diagnose hardware, software, and computer system issues.
  • Investigate complex tool performance issues and help develop and deploy new features in real time.
  • Develop and optimize process parameters for Advanced Packaging inspection applications, including tool sign-off negotiations with customers.
  • Support hardware qualification tests and tool bring-up with new hardware configurations.
  • Develop new inspection workflows and help customers maximize the value of the tool.
  • Drive process integration solutions and improve existing processes, including troubleshooting excursions on qualified processes.
  • Support process specification negotiations and participate in product and project presentations with sales and management.
  • Identify customer high-value problems and surface inflections, threats, and opportunities for share and total addressable market growth.
  • Provide input to the Business Unit on modifications to existing product design based on field observations.
  • Collaborate with remote engineering and service teams, serving as their on-site point of observation.
  • Perform other duties as assigned.
Desired Qualifications
  • Familiarity with Python for scientific data acquisition and instrument control.
  • Experience with EPICS (Experimental Physics and Industrial Control System) or a similar distributed motion control and data acquisition platform.
  • Background in X-ray technology, synchrotron instrumentation, or similar photon-based techniques, such as beamline technician or laboratory X-ray systems experience.
  • Familiarity with semiconductor process tools, fab environments, or capital equipment.
  • Experience with data analysis tools such as JMP, statistical process control, MATLAB, or Mathematica; design of experiment principles; and semiconductor processes in metrology.
  • Recent graduates and R&D technicians with relevant instrumentation experience, such as synchrotron engineers or technicians, are encouraged to apply.

About the company

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

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Simplify Jobs

Simplify's Take

What believers are saying

  • Installed equipment brings repeat business: Applied Global Services sells long-term service agreements, replacement parts and equipment upgrades.
  • Sales are expanding: Applied's August 2026 report showed fiscal Q3 revenue of $9.12 billion, up 25% yearly.
  • Employees join profitable operations: Applied reported $3.08 billion of operating profit for fiscal Q3 in August 2026.

What critics are saying

  • Singapore manufacturing hires face late shifts: Applied's live engineering posting specifies 4 p.m. to 1:30 a.m. schedules.
  • Export compliance has real costs: Applied and its Korea subsidiary settled a $252 million penalty in February 2026.
  • Sales depend on China access: Applied's December 2025 filing attributed 30% of fiscal 2025 revenue to customers there.

What makes Applied Materials unique

  • Applied combines manufacturing steps under vacuum: its Endura copper platform integrates seven processes to protect delicate material interfaces.
  • Factory software reaches beyond chips: Applied SmartFactory serves battery and pharmaceutical manufacturers alongside semiconductor plants.
  • Research targets future chip generations: Applied's EPIC partners work on technology three to four generations ahead of production.

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Benefits

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Disability Insurance
  • Relocation Assistance
  • Performance Bonus
  • Stock Options
  • Flexible Work Hours

Growth & Insights and Company News

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Yahoo Finance
Oct 24th, 2026
Applied Materials stock falls 24% since October 12 after investor day offers no spending forecast

Applied Materials shares have fallen 24% since October 12, from $497.53 to $377.24 at Friday's close. The drop followed an October 13 investor presentation in which the company set ambitious profit targets but gave no forecast for wafer fab equipment (WFE) spending. By 2030, Applied Materials targets a non-GAAP gross margin of about 54% and an operating margin of 40%. Chief executive officer Gary Dickerson declined to give a WFE forecast but expressed "tremendous confidence" in computing demand. The stock fell 6.7% on October 13, more than rivals Lam Research, KLA, and ASML, which lost roughly 2.6% to 3.5%. It trades at about 21.4x forward earnings, down from nearly 49x in late June. The company reports fiscal fourth-quarter earnings on November 12. Analysts expect revenue of about $10.30 billion and adjusted earnings of $4.06 per share. China accounts for about 30% of fiscal 2025 revenue.

Chief in Tech
Oct 16th, 2026
China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics.

China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics. 10/16/2026 Your morning in 30 seconds. * China's semiconductor industry surges ahead, fueled by U.S. export controls (Fortune). * Applied Materials and Intel announce a new partnership to accelerate AI-focused chipmaking (DQIndia). * ASML's hybrid bonder patent signals the next wave of advanced chip packaging (DigiTimes). * U.S. chipmakers' overseas production dependence exceeds 95%, SIA reveals (DigiTimes). * Asia startup funding tops $353M this week, led by Tessolve in semiconductors (Techloy). The lead. China's chip sector advances amid export controls. * China's domestic semiconductor sector is making rapid breakthroughs, with export controls from the U.S. acting as a catalyst for increased innovation and self-sufficiency (Fortune). * Recent advancements include new chip manufacturing capabilities and increased market share for Chinese suppliers. * The sector's progress is shifting the geopolitical balance in global technology supply chains. * U.S. restrictions, intended to slow China's progress, have instead accelerated domestic R&D and investment in Chinese chip firms. * The development raises questions about future supply chain resilience and the potential need for supplier diversification. * Source: Fortune * Why it matters: Executives must reassess supply chain strategies and risk exposure as geopolitical forces drive rapid realignment in global chip manufacturing. What changed. Applied Materials and Intel partner on AI chipmaking. * Applied Materials and Intel have formed a strategic collaboration to develop next-generation semiconductor fabrication processes tailored for AI workloads (DQIndia). * The partnership will focus on overcoming scaling challenges and boosting chip performance for advanced computing. * This move is designed to maintain a competitive edge in the race for AI hardware innovation. * Source: DQIndia * Implication: Tech leaders should watch for new fabrication technologies that could influence AI infrastructure roadmaps. ASML's hybrid bonder patent drives packaging innovation. * ASML has patented a hybrid bonder, a key enabler for advanced chip packaging as traditional scaling approaches hit physical limits (DigiTimes). * The technology is expected to improve efficiency and performance in semiconductor manufacturing. * This move reflects growing industry focus on packaging as a differentiator for next-gen chips. * Source: DigiTimes * Implication: Executives should evaluate how packaging advances may alter chip design, procurement, and partnerships. SIA finds U.S. Chipmakers rely heavily on overseas production. * The Semiconductor Industry Association (SIA) reports that U.S. chipmakers source 95% of their manufacturing equipment and materials from foreign suppliers (DigiTimes). * The finding contradicts previous assumptions about domestic self-sufficiency. * Heightened geopolitical risks highlight the need for robust supply chain strategies. * Source: DigiTimes * Implication: Supply chain diversification and contingency planning should be board-level priorities. Asia startup funding surges, led by Tessolve. * Asia's tech startups raised $353.73 million in the past week, with major investments in semiconductors, robotics, and electric mobility (Techloy). * Tessolve, a semiconductor firm, tops the funding list, reinforcing the region's growing influence in deep tech. * The funding landscape signals opportunities for new partnerships and expansion in Asia. * Source: Techloy * Implication: Executives exploring global growth should prioritize engagement with Asia's dynamic startup ecosystem. Cybersecurity job postings hit four-year low. * Cybersecurity job postings have dropped to the lowest level since 2022, according to Help Net Security. * Compliance roles are increasingly sought after, while CISO hiring remains volatile. * The trend suggests an industry-wide reevaluation of cybersecurity needs and workforce planning. * Source: Help Net Security * Implication: Rethink talent acquisition and upskilling strategies to align with evolving security priorities. Signals. * Iberdrola, BBVA, and Santander complete a €150M syndicated loan entirely on blockchain, advancing financial transparency (The Paypers). * Flipkart alumni advocate for ESOP buyouts, spotlighting ongoing debates over employee equity (Economic Times). * BTQ partners with MoonPay Korea to bolster stablecoin security, reinforcing the importance of digital asset protection (The Paypers). * Mastercard and BVNK launch a global money platform integrating fiat and stablecoin payments, aiming for real-time, cross-border efficiency (The Paypers). Chief in Tech Perspective: This week's deeptech surge is a call to action for women leaders in technology: proactive board engagement on supply chain, innovation, and cybersecurity is critical as global dynamics shift. Championing diverse leadership at the intersection of semiconductors, AI, and fintech will be essential for navigating risk and seizing new opportunities.

TechNode Global
Oct 15th, 2026
Applied Materials unveils $5B semiconductor R&D center in Silicon Valley.

Applied Materials unveils $5B semiconductor R&D center in Silicon Valley. Applied Materials has unveiled an Equipment and Process Innovation and Commercialization Center in Silicon Valley, a US$5 billion investment intended to support semiconductor equipment and process research. The company described the EPIC Center as a 600,000-square-foot facility bringing chipmakers, equipment manufacturers and university researchers together to accelerate the development of new semiconductor technologies. Applied Materials identified TSMC, Intel, Samsung, Micron and SK hynix among founding partners. Other companies cited in the announcement include Broadcom, Advantest, SCREEN, KIOXIA and Besi. The project is aimed at reducing the time between research breakthroughs and high-volume chip manufacturing, as growing AI demand raises performance and efficiency requirements. Its anticipated benefits are company expectations, not independently verified development outcomes. The facility is in the United States, but several announced participants are headquartered in Asia, giving the project a direct connection to the region's semiconductor industry.

Tech in Asia
Oct 15th, 2026
Applied Materials opens $5B AI chip research hub with TSMC, Intel, Samsung, Micron and SK hynix

Applied Materials has unveiled an AI chip research hub that brings together chipmakers, equipment suppliers, and university researchers to develop chipmaking technologies for AI. The centre spans 600,000 square feet and includes nearly four acres of cleanroom space for semiconductor process technology and equipment research. Founding partners are TSMC, Intel, Samsung, Micron, and SK hynix. Research partners include Arizona State University, Stanford University, the University of California, Berkeley, the UCLA Samueli School of Engineering, and Rensselaer Polytechnic Institute. Applied Materials expects capital spending to reach about $5 billion over time as customer projects begin.

DIGITIMES
Oct 15th, 2026
Applied Materials targets US$5 billion advanced packaging revenue.

Applied Materials targets US$5 billion advanced packaging revenue. , San Francisco Oct 15, 2026, 10:23 0 Credit: DIGITIMES Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years... Picks for you