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Powerlattice

Integrated power-delivery chiplet for compute

Senior or Staff Embedded Software Engineer

Embedded EngineeringConfirmed live in the last 24 hours
Full-timeChandler, AZ, USA

About the Job

Requirements

  • A Bachelor of Science or Master of Science degree in electrical engineering or a related field.
  • At least 7 years of bring-up or embedded firmware-level software development experience.
  • Strong Python skills for automation, scripting, and test framework development.
  • Experience with embedded system bring-up and debugging.
  • Familiarity with I2C, SPI, I3C, and JTAG communication interfaces.
  • Experience automating and controlling laboratory instruments, including digital multimeters, oscilloscopes, and power supplies.
  • A solid understanding of embedded systems fundamentals, including interrupts, peripherals, and timing.
  • Experience with databases for validation data management.
  • Experience developing graphical user interface applications.

Responsibilities

  • Design and implement Python-based validation frameworks, drivers, and automation tools.
  • Build and maintain scalable validation infrastructure, including regression systems.
  • Design device drivers, board-support packages, hardware interfaces, and low-level firmware.
  • Develop graphical user interfaces and tools for customer debugging and evaluation kits.
  • Create and maintain databases for test logs, results, and analysis.
  • Debug system-level issues across firmware, software, and hardware interfaces.
  • Collaborate with hardware, validation, and silicon teams during bring-up and testing.
  • Develop embedded firmware in C for microcontrollers.

Desired Qualifications

  • Experience in one or more areas such as wireless, networking, motor control, power management, sensors, security, bootloaders, or high-performance computing.
  • Silicon bring-up experience.
  • Firmware programming and debugging experience.
  • Manufacturing deployment and debugging experience.
  • Ability to read schematics and support board-level analog and digital debugging.

About the Company

Powerlattice

Integrated power-delivery chiplet for compute

PowerLattice develops power delivery chiplets that sit in the processor package to provide voltage regulation directly at the compute die. The chiplet packages miniaturized on-die inductors, voltage control circuits, a vertical packaging design, and a programmable software layer on a single silicon die to move power delivery closer to the compute core. This near-die integration differs from typical power management by delivering regulatory functions inside the chiplet itself, enabling substantial energy savings and easier scaling across AI accelerators, GPUs, and data-center CPUs. The goal is to improve efficiency and performance for next-generation compute by offering modular, near-die power regulation to hyperscalers, OEMs, and system integrators, with early sampling and trials planned for 2026.

Company size
11-50
Company stage
Late Stage VC
Total funding
$111M
Headquarters
Vancouver, WA
Founded
2023

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