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HyperLight

Photonic integrated circuits for data centers

Senior Product Engineer - Test & Measurement

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeCambridge, MA, USA

About the Job

Requirements

  • A Ph.D. in a photonics-related field such as Physics, Optics, or Engineering is required.
  • Experience with integrated photonics design and test, and radio frequency design and testing is required.
  • Experience with high-speed electro-optical modulator design and test is required.
  • Strong written and oral communication skills are required.
  • Ability to work under time constraints is required.
  • Desire to deliver innovative products to market is required.
  • Ability to solve problems in new or ambiguous scenarios is required.
  • Authorization to work in the United States is required.

Responsibilities

  • Conduct research and development of thin-film lithium niobate photonic devices, including modulators and other electro-optic components.
  • Develop and optimize test methodologies and characterization setups for high-speed photonic devices.
  • Design and execute experiments to evaluate optical, radio frequency, and electro-optic performance of prototype devices.
  • Analyze device performance and identify opportunities for performance improvement and innovation.
  • Work closely with device design, fabrication, and test teams to iterate on new device concepts and prototype designs.
  • Analyze measurement and simulation data for performance and robustness.
  • Work with vendors and contract manufacturers to evaluate advanced fiber components, high-speed radio frequency components, and advanced packaging services.
  • Lead build, validation, and production testing to ensure products meet or exceed performance and reliability specifications.

About the Company

HyperLight

Photonic integrated circuits for data centers

HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.

Company size
51-200
Company stage
Series C
Total funding
$117M
Headquarters
Cambridge, MA
Founded
2018

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