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Kandou AI

Provides chip-to-chip AI connectivity solutions

FPGA Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeHyderabad, Telangana, IndiaNo salary listedIn-person

About the Job

Requirements

  • Demonstrated RTL development skills with 5 or more years of experience, of which no more than 1 year may be academic.
  • Proficiency in Verilog and C programming.
  • Proficiency in using Linux for lab testing.
  • Clear understanding and use of AXI and related AMBA protocols to connect multiple logical blocks in an FPGA.
  • Demonstrated computer architecture understanding in at least one of processors, PCIe, Ethernet, or storage protocols.
  • Must have shipped FPGA design in at least one of the following: compute accelerators, networking, storage, or processor prototyping.
  • Must have micro-architected, designed, and shipped at least two key logic functions of high or medium complexity in an FPGA design.
  • Must have participated in lab bring-up and validation of shipping FPGAs in the lab and in deployed use.
  • Must be familiar with the Xilinx development tool chain and Versal and Virtex FPGAs.
  • A four-year Bachelor of Technology/Engineering degree or equivalent in Computer Science, Computer Engineering, Electronics, or a related field is required.

Responsibilities

  • Own prototyping Kandou’s architectures in FPGA as a key member of a small FPGA team.
  • Work independently with low day-to-day supervision and own FPGA projects.
  • Work with Kandou’s architecture and system software teams on FPGA prototyping and participate in the entire project lifecycle, including support.
  • Participate in technical discussions with IP providers and drive some of those discussions.

Desired Qualifications

  • Working exposure to SystemC and Python scripting.
  • Deep exposure to PCIe devices, including protocol design and lab work.
  • Deep exposure to data path blocks involving embedded processors in the FPGA, such as PCIe, networking, or storage.
  • A Master of Technology/Engineering degree or equivalent in Computer Science, Computer Engineering, Electronics, or a related field is a plus but not required.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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