DCP-Electronics Hardware Engineer - Global, SZ

Senior Power Electronics Engineer (Shenzhen)

Location: Shenzhen, China
Company: Foreign-invested enterprise

Responsibilities

1. Power Electronics Product Development
   • Lead the design and development of power electronics products, such as inverters, converters, charging modules, and power management systems.
   • Responsible for topology design, component selection, magnetic component design, and thermal design to ensure system performance and reliability.
2. Technical Verification & Testing
   • Plan and perform electrical performance, safety, and EMC tests; drive prototype validation and functional debugging.
   • Analyze and resolve technical issues related to electrical design, thermal management, and EMI/EMC during the development process.
3. Project Management & Cross-functional Collaboration
   • Participate in project initiation and technical evaluation, define development plans, and ensure on-time delivery.
   • Collaborate closely with global R&D teams, suppliers, and manufacturing teams to support the entire product lifecycle from R&D to mass production.
4. Standards & Compliance
   • Ensure designs comply with international and domestic standards (e.g., IEC, UL, GB).
   • Stay up to date with industry trends, advanced technologies, and new components in the field of power electronics, and apply them to product development.
5. Team Support & Guidance
   • Provide technical coaching and training to junior and mid-level engineers.
   • Participate in technical reviews and intellectual property development (e.g., patents), contributing to overall R&D capability enhancement.

Qualifications

• Master’s degree or above in Power Electronics, Electrical Engineering, Automation, or related fields.
• 5+ years of experience in power electronics product development; background in high-power supplies, PV/storage inverters, EV chargers, or automotive powertrain electronics is a plus.
• Solid knowledge of common power electronics topologies (e.g., Buck/Boost, LLC, Full-Bridge, Three-Level). Skilled in magnetic component design and thermal simulation.
• Proficient in applying and driving power devices (IGBT, SiC, GaN).
• Strong English communication skills, capable of working effectively with overseas R&D teams.
• Excellent problem-solving, analytical, and innovative thinking skills.