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nEye

Programmable optical switches for data centers

Principal Systems Packaging & Assembly Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USA$180k - $240k /yrIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field is required.
  • At least 15 years of experience in semiconductor or photonics packaging engineering is required.
  • Extensive experience in IC package design and back-end assembly process development in a manufacturing environment is required.
  • A strong background in advanced packaging technologies, including flip-chip and wirebond hybrid assemblies; BGA, FCBGA, CSP, or WLCSP; multi-die stacking (2.5D or 3D integration); and System-in-Package, is required.
  • Proven experience driving New Product Introduction programs from concept to high-volume production is required.
  • Hands-on experience working with OSATs and contract manufacturers is required.
  • Strong knowledge of yield improvement, failure analysis, and process development is required.
  • The candidate must be able to lead projects and guide engineers as a senior technical contributor.
  • Hands-on expertise with die bonders, dispensers, reflow or TCB tools, wirebonders, and interface metrology tools including CSAM, X-ray, and AOI is required.
  • A strong background in materials characterization and statistical process control methods, including DOE, FMEA, and SPC, is required.

Responsibilities

  • Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.
  • Lead package and assembly integration of complex multi-component systems that include MEMS devices, photonic ICs, ASICs, substrates, and optical interfaces.
  • Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.
  • Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.
  • Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach and alignment, and hybrid integration.
  • Develop and implement fixtures, jigs, and tooling at OSATs to support prototype builds and New Product Introduction.
  • Establish process flows, bill of materials structures, and manufacturing documentation for new products.
  • Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.
  • Lead New Product Introduction activities from prototype builds through production ramp.
  • Work with OSAT partners, contract manufacturers, and suppliers to meet product requirements.
  • Drive process qualification, yield ramp, and reliability validation.
  • Implement root cause analysis, corrective actions, and failure analysis workflows.
  • Work directly with OSATs, substrate vendors, optics suppliers, and strategic partners.
  • Lead technology transfer from engineering to manufacturing partners.
  • Act as a technical program manager for packaging and assembly development across multiple engineering teams.
  • Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.
  • Track program milestones and ensure packaging readiness aligns with product development timelines.

Desired Qualifications

  • Experience with fiber attach and photonic IC packaging is preferred.
  • A background in optical transceivers, co-packaged optics, or photonics modules is preferred.
  • Experience with optical modules, photonics packaging, or MEMS devices is preferred.
  • Experience with optical alignment and hermetic packaging solutions is preferred.
  • Six Sigma certification is preferred.
  • Familiarity with substrate layout tools and packaging design environments such as Cadence SiP, AutoCAD, or SolidWorks is preferred.

About the Company

nEye

Programmable optical switches for data centers

nEye Systems designs programmable photonic integrated circuits (PICs) that implement high-radix optical circuit switching on a silicon chip. Their main product is a programmable optical switch built on silicon photonics, enabling high-capacity, low-power data paths for AI, ML, and other data-intensive workloads. The system uses a PIC-based switch fabric that can be configured to route optical signals through many channels, reducing electrical power needs and easing network scaling in data centers. Compared with competitors, nEye focuses on integrating high-radix, programmable optical switching directly on silicon wafers to deliver scalable, energy-efficient networking for AI infrastructure, leveraging MEMS photonics and silicon photonics techniques. The company aims to make data center networks more power-efficient and scalable to meet rising demands from AI and ML workloads.

Company size
11-50
Company stage
Series C
Total funding
$152.5M
Headquarters
Berkeley, CA
Founded
2020

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