DFM R&D Engineer - Advanced Simulation & Materials

Summary

At Apple, innovative ideas become extraordinary products through deep engineering rigor and strong cross-functional collaboration. The DFM R&D Lab plays a critical role in developing the materials, processes, and predictive modeling frameworks that enable advanced semiconductor packaging and microelectronics technologies to scale reliably to high-volume manufacturing. We are seeking an R&D Engineer who is excited to solve complex mechanical challenges, connect simulation with real-world data, and influence product decisions through thoughtful, physics-based analysis.

Minimum Qualifications

7+ years of experience in finite element modeling Strong foundation in solid mechanics and thermomechanics Experience with CAE tools such as Ansys, Abaqus, or equivalent Experience working with materials used in microelectronics applications MS or PhD in Mechanical Engineering, Materials Science, Applied Mechanics, Chemical Engineering, or related field

Preferred Qualifications

Experience in warpage, fracture mechanics, fatigue, or drop/impact modeling Familiarity with semiconductor packaging and SMT processes Experience correlating simulation models with physical testing Understanding of DOE methodology and reliability physics Strong written and verbal communication skills Comfortable working in a fast-paced, cross-functional environment

Description

This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages, PCB systems, and SMT assemblies — developing predictive models that inform design direction, reliability strategy, and manufacturing readiness. You’ll partner closely with design, reliability, and manufacturing teams to define key load cases, build and validate material models, and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation.

Responsibilities

Develop and execute finite element models (implicit and explicit) for semiconductor packaging, PCB structures, and SMT assemblies Analyze thermo-mechanical behavior including warpage, stress evolution, drop/shock, fatigue, and fracture Lead or support material characterization efforts (mechanical, physical, chemical) for microelectronics materials Build, calibrate, and validate material models using experimental data Design and execute DOEs to correlate simulation with test results and support reliability projections Drive early design optimization and support root cause investigations of mechanical failures Integrate module-level simulations into larger product assembly models Communicate analysis results clearly to cross-functional stakeholders