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NXP Semiconductors

Automotive semiconductors and secure embedded solutions

Die Attach Equipment Technician

Equipment MaintenanceConfirmed live in the last 24 hours
Full-timeKuala Lumpur, Federal Territory of Kuala Lumpur, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A diploma in Electrical & Electronics or Mechanical and Engineering discipline, or a certificate with a minimum of five years of relevant experience in Die Attach equipment.
  • Experience in semiconductor assembly and applied statistics is advantageous.
  • Technical skills on Front and Back End assembly equipment.
  • Familiarity with production environments and semiconductor process handling.
  • Willingness to work long hours and shifts.
  • Adherence to NXP Total Quality Mindset and safety awareness.
  • Adherence to NXP core values of Trust and Respect, Collaboration, Ownership, Expertise, Innovation, and Growth.

Responsibilities

  • Maintain and repair the Die Attach integrated line, including loader, unloader, die attach, AOI, and reflow oven equipment.
  • Set up or convert the Die Attach integrated line for product changes.
  • Independently identify, sustain, purchase, and find second sources for critical Die Attach equipment spares and tooling.
  • Maintain and sustain equipment performance to meet defined goals.
  • Improve FC Overall OEE, MTBA/MTBF, preventive maintenance effectiveness, and unscheduled downtime.
  • Maintain machine performance, address root causes, and solve quality issues caused by machines.
  • Support production to meet weekly schedule targets by working normal or shift hours when needed, including weekends and public holidays.
  • Manage machine maintenance activities and spare-parts fabrication.

Desired Qualifications

  • Experience with Datacon 8800 FC QUANTUM Die Attach equipment is required; experience with Hanwha Die Attach equipment is preferred.

About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size
10,001+
Company stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004

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