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Cadence Design Systems

Develops EDA software, IP, verification tools

Principal Product Engineer - 3D IC, Heterogeneous Integration & Advanced Packaging

Technical Product ManagementConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USAIn-person

About the Job

Requirements

  • A BS in Electrical Engineering, Electronics, or a related technical field is required.
  • Strong experience in semiconductor design, physical implementation, advanced packaging, or electronic design automation product engineering is required.
  • Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom integrated circuit design flows is required.
  • At least 10 years of relevant experience, or equivalent demonstrated expertise, is required.
  • Ability to work independently, prioritize effectively, and take responsibility for technical deliverables is required.
  • Strong verbal and written communication skills, including the ability to collaborate effectively across global and multicultural teams and functions, are required.

Responsibilities

  • Drive, validate, and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration, and advanced packaging.
  • Partner with leading semiconductor customers to understand complex system co-design challenges and translate them into clear product specifications.
  • Produce Product Requirement Specifications, technical use cases, and support Research and Development throughout product development.
  • Collaborate cross-functionally with Research and Development, Product Management, Field teams, Technical Publications, and Product Validation to deliver robust, customer-ready capabilities.
  • Create and deliver demonstration collateral, application workflows, and enablement materials to accelerate customer and field adoption.
  • Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive bug and enhancement prioritization.
  • Support product launches, customer engagements, and industry events.
  • Own deliverables from definition through customer deployment, with a focus on execution and accountability.

Desired Qualifications

  • Experience with software product definition, validation, or technical marketing activities.
  • Experience with co-design flows around 3D IC, heterogeneous integration, and silicon-package-board integration.
  • Knowledge of Cadence Allegro Package Designer Plus and package implementation methodologies.
  • Knowledge of Cadence Virtuoso SKILL language or another interpreted language.

About the Company

Cadence Design Systems

Develops EDA software, IP, verification tools

Cadence Design Systems supplies software, hardware, and IP for electronic design automation (EDA) to help customers create advanced semiconductor chips and electronic systems. Its tools handle system design, verification, digital and analog IC design, and custom flows, while IP such as Tensilica processors and DSP cores can be licensed for integration into customer products. The offerings are delivered as software licenses with maintenance and support, plus IP licensing and occasional hardware-accelerated options. The company differentiates itself with a broad, end-to-end EDA portfolio and close collaboration with industry leaders to streamline the path from concept to silicon, aiming to help customers bring sophisticated silicon and electronics to market faster with lower risk and higher productivity.

Company size
10,001+
Company stage
IPO
Headquarters
San Jose, CA
Founded
1988

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