K

Kandou AI

Provides chip-to-chip AI connectivity solutions

Staff Engineer - Embedded Firmware, CXL/PCIe/Memory Controller

Embedded EngineeringConfirmed live in the last 24 hours
Full-timePune, Maharashtra, IndiaNo salary listedIn-person

About the Job

Requirements

  • A Bachelor’s degree in Electrical Engineering or Computer Science is required; a Master’s degree is preferred.
  • Experience developing firmware for bare-metal or real-time operating system environments running on on-chip microcontrollers or processors.
  • At least 8 years of experience developing firmware for server, storage, and/or networking system-on-chip products.
  • Hands-on experience designing and developing embedded firmware for PCIe, CXL, and NVMe protocols, with proficiency in C or C++, including development of C-based software development kits.
  • Experience with RTOS or Zephyr OS firmware development and enablement.
  • Familiarity with system-on-chip interfaces to common intellectual property blocks, including PCIe controllers, NVMe controllers, DDR controllers, AMBA/AHB interfaces, and on-chip memory interfaces.

Responsibilities

  • Develop firmware modules and services for Kandou’s memory fabrics products.
  • Implement and support the major differentiating features of Kandou’s products.
  • Work with cross-functional groups, including architects, development teams, quality assurance and validation, product management, and customer teams across various sites.

Desired Qualifications

  • Experience with DDR controller, storage, or SSD firmware, including NVMe, PCIe, CXL, or flash management concepts.
  • Hands-on experience with simulation or virtual platform-based development, such as Renode or QEMU.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

Recently Posted Jobs

Explore more opportunities at Kandou AI

See more jobs