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Blue Origin

Builds rockets, engines and lunar spacecraft

Principal Radio Frequency/Mmwave Integrated Circuit Layout Design Engineer

Silicon & ASIC DesignPosted on Oct 30
Full-time

About the Job

Requirements

  • A B.S. degree in Electrical Engineering, Electronic Engineering, Computer Engineering, or a related technical field is required.
  • At least 10 years of professional experience in RF/mmWave, analog, or mixed-signal custom IC layout and physical implementation is required.
  • Extensive hands-on experience with high-frequency RF/mmWave IC layout in RF CMOS, SOI, SiGe, or related advanced semiconductor processes is required.
  • Successful completion of multiple IC product lifecycles or tape-outs is required, preferably including high-volume or mission-critical chipsets.
  • Strong expertise in layout and integration of RF transmitter and receiver front-end circuits, including one or more full TX/RX chains, is required.
  • Direct experience laying out RF/mmWave blocks such as LNAs, PAs, mixers, VCOs, frequency synthesizers, phase shifters, VGAs, multipliers, and RF passives is required.
  • Strong understanding of device-level layout techniques, including matching, symmetry, shielding, common-centroid layout, interdigitation, guard rings, and isolation structures, is required.
  • Strong understanding of parasitic effects, coupling mechanisms, grounding strategies, substrate noise isolation, differential routing, and RF signal integrity is required.
  • Experience with analog building blocks such as operational amplifiers, bias generators, temperature sensors, LDOs, ADCs, DACs, and related support circuitry is required.
  • Strong understanding of physical design sign-off flows, including LVS, DRC, ERC, parasitic extraction, EM/IR analysis, current density, and electromigration requirements, is required.
  • Proficiency with IC layout and verification tools such as Cadence Virtuoso/Virtuoso XL, Siemens Calibre, Quantus, EMX, or equivalent tools is required.
  • Experience with top-level integration, including floorplanning, hierarchical integration, ESD, pad integration, density fill, DFM, and tape-out preparation, is required.
  • Strong communication skills and the ability to work independently on complex layout challenges while influencing technical direction across teams are required.
  • Applicants must be a U.S. citizen or national, U.S. permanent resident/current Green Card holder, or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

  • Lead physical design and implementation of RF/mmWave integrated circuits, including transmitter and receiver front-end blocks such as power amplifiers, low-noise amplifiers, phase shifters, variable-gain amplifiers, mixers, multipliers, VCOs, frequency synthesizers, and supporting analog/RF circuitry.
  • Drive block-to-top integration, including chip-level floorplanning, power and ground planning, signal routing, ESD strategy, pad assembly, density fill, and design-for-manufacturability requirements.
  • Lead chip-level integration approaches that optimize RF performance, isolation, area, reliability, and manufacturability.
  • Perform and debug physical verification, including DRC, LVS, ERC, antenna checks, density checks, and related sign-off requirements.
  • Support parasitic extraction and post-layout analysis; collaborate with circuit designers to resolve performance, coupling, EM, IR, reliability, and extraction-related issues.
  • Develop layout schedules, identify implementation risks and dependencies, and deliver verified layouts aligned with program milestones and tape-out schedules.
  • Prepare and release final layout databases to the foundry, including support for tape-out readiness reviews and mask database delivery.
  • Lead layout reviews, define and document best practices, and mentor less-experienced layout engineers and designers.
  • Coordinate layout execution across internal teams, third-party design partners, and cross-functional stakeholders across multiple locations.

Desired Qualifications

  • Prior experience managing or technically leading a layout team, including mentoring layout engineers and coordinating multiple contributors.
  • Experience with beamforming front-end ICs, phased-array architectures, or highly integrated RF/mmWave transceivers.
  • Experience with high-performance IC development using III-V technologies such as GaAs or GaN.
  • Experience implementing and optimizing RF passive structures, including inductors, transformers, capacitors, transmission lines, baluns, and matching networks.

About the Company

Blue Origin

Builds rockets, engines and lunar spacecraft

Blue Origin builds rockets, engines and spacecraft for commercial satellite operators and government space programs. Its New Glenn orbital rocket uses a reusable first stage, while Blue Moon landers are designed to transport cargo and astronauts to the lunar surface. The company designs and manufactures liquid-fueled propulsion systems, and its New Shepard vehicle is built for short suborbital trips carrying people and research payloads. Customers pay for launch services and engines, and government development contracts fund work on systems for exploration beyond Earth orbit. Founded by Jeff Bezos in 2000, Blue Origin is headquartered in Kent, Washington.

Company size
10,001+
Company stage
Late Stage VC
Total funding
$10.1B
Headquarters
Kent, WA
Founded
2000

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