Qualcomm

Designs mobile chips and licenses wireless patents

Staff Radio Frequency Device Engineer - Foundry Interface, ASICS Engineering

Hardware EngineeringConfirmed live in the last 24 hours

Full-timeSan Diego, CA, USAIn-person

About the Job

Requirements

A bachelor's degree in Science, Engineering, or a related field and 4 or more years of ASIC design, verification, validation, integration, or related work experience; or a master's degree in those fields and 3 or more years of relevant work experience; or a PhD in those fields and 2 or more years of relevant work experience.
A minimum of 8 years of industrial experience developing advanced CMOS processes and devices is preferred.
Excellent understanding of RF-CMOS, SOI or BiCMOS, process integration, reliability, design rules, and best layout practices.
Excellent understanding of process design kit details, including design rule checking, layout versus schematic, and parasitic extraction.
Proficiency in device-level test-structure development, design of experiments, statistical analysis, and data-driven problem solving.
Excellent understanding of sub-micron process/device optimization and its impact on digital, analog, RF, and high-voltage circuit design and product-level performance.
Good knowledge of RF and DC characterization of devices on wafers and in product integrated circuits, including S-parameters, harmonics, and noise figure.
Good knowledge of technology evaluation and benchmarking, statistical process control monitoring, and reliability qualification.
Good understanding of BSIM and PSP-SOI device models and ability to run hardware correlations.
Good communication skills and demonstrated ability to meet deadlines and commitments.

Responsibilities

Drive bulk silicon and RFSOI technology evaluation, development, and design enablement for RFFE designs, including RF switching and antenna circuits, receivers, and transmitters.
Work with design and product teams to define process and device requirements for continuous technology improvements.
Define and execute test-structure design of experiments, layout, and characterization for process evaluation to meet design requirements.
Design, simulate, and test RF circuits to understand process-design-layout interactions and guide optimization for optimum performance.
Interact with internal design teams, process design kit teams, reliability, and product engineering to ensure technology support.
Support design, layout, PTE, and reliability teams in addressing questions and resolving device and design optimization issues.
Assure product quality by devising testing methodology and testing product and system capabilities.
Work independently on assigned tasks, with full ownership of technical execution and schedule commitments.
Innovate methods for continuous device and process improvement and support automation and AI-assisted workflows.

Desired Qualifications

Experience designing wafer-level designs, including analog integrated circuits, low-noise amplifiers, and power amplifiers, and circuit design flows is a plus.
Ability to tweak and update device models is a plus.
Fab device engineering or process integration experience, preferably in RF devices, is a plus.
Foundry and outsourced semiconductor assembly and test interface experience is a plus.

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

As a member of the Qualcomm Si Process Packaging Solutions (PPS) team, this candidate will drive Si process technology evaluation, development, design enablement and productization for Mixed-Signal/RF products at foundry partners.

Responsibilities

Drive bulk Si and RFSOI technology evaluation, development and design enablement for RFFE designs, including RF switching and antenna circuits, receivers, transmitters.
Work with Qualcomm design and product teams to define process and device requirements for continuous technology improvements.

Define and execute test structures DOE, layout and characterization for process evaluation to meet design requirements.

Design, simulate and test RF circuits to understand the process-design-layout interaction to guide process-design-layout optimization to achieve optimum performance.
Interact with internal design teams, PDK teams, reliability, and product engineering to ensure technology support.
Support Qualcomm design, layout, PTE and reliability teams to address their questions and resolve any device and design optimization issues.
Assure product quality by devising testing methodology, and testing product and system capabilities.
Work independently on assigned tasks with full ownership of technical execution and schedule commitments.
Innovate new methods for continuous device and process improvement; support automation and AI-assisted workflows.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

Preferred Qualifications:

Minimum of 8+ years of industrial experience developing advanced CMOS processes and devices
Excellent understanding of the RF-CMOS, SOI or BiCMOS, process integration, reliability, design rules and best layout practices.
Excellent understanding of PDK related details including DRC, LVS, LPE, etc.
Proficiency in device level test-structure development, DOE design, statistical analysis, and data-driven problem solving
Excellent understanding of sub-micron process/device optimization and its impact on digital/analog/RF/HV circuit design and product level performance is required. Experience designing wafer level designs (analog IPs, LNA, PAs) and circuit design flows is plus.
Good knowledge of RF (e.g. S-parameters, Harmonics, Noise Figure) and DC characterization of devices on wafers, and in product ICs.
Good knowledge of technology evaluation/benchmarking, SPC monitoring, and reliability qualification.
Good understanding of BSIM, PSP-SOI device models and ability to run hardware correlations. Ability to tweak and update models is a plus.
Fab device engineering or process integration experience preferably in RF devices is a plus.
Foundry and OSAT interface experience is a plus.
Good communication skills and demonstrated ability to meet deadlines and commitments.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$145,600.00 - $218,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size: 10,001+
Company stage: IPO
Headquarters: San Diego, CA
Founded: 1985

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