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Microchip Technology

Provides embedded hardware, software, tools

Principal Engineer - Applications

Full-Time
No salary listed
Expert
Bachelor's
Chennai, Tamil Nadu, India
In Person
Solution Engineering

About the job

Requirements
  • Bachelor’s degree in Electrical Engineering, Electronics Engineering, Communication Engineering, or a related technical discipline.
  • Typically requires extensive experience in embedded systems, wireless applications, firmware development, customer support, or systems applications engineering.
  • Strong hands-on experience in embedded software and firmware development, including bare-metal and framework-based development.
  • Expert-level programming experience in C and C++ for embedded systems.
  • Strong understanding of embedded software architecture, firmware design, driver development, debugging, and system optimization.
  • Deep knowledge of wireless technologies and hands-on experience integrating, validating, and debugging wireless protocol stacks, including Wi-Fi, Bluetooth/BLE, IEEE 802.15.4 and Other low-power wireless connectivity technologies
  • Strong knowledge of protocol stacks and the OSI networking model, particularly for wireless and embedded networking systems.
  • Experience with RTOS and embedded operating environments such as FreeRTOS, Zephyr, Linux-based embedded systems and Other real-time embedded frameworks
  • Experience with 8-bit, 16-bit, and 32-bit microcontrollers and embedded peripherals, including: ADC, DAC, PWM, RTC, WDT, Timers/counters, GPIO, DMA and Interrupt controllers
  • Strong knowledge of communication interfaces and peripheral protocols, including: I2C, SPI, UART, CAN and USB
  • Strong ability to debug complex system-level embedded issues involving firmware, hardware, wireless connectivity, timing, memory, power, and peripheral interactions.
  • Hands-on experience with lab and debugging tools (oscilloscopes, logic/protocol analyzers, RF equipment, debug probes, IDE tools) and good understanding of hardware design concepts such as schematic review, PCB layout, signal integrity, power design, and RF guidelines.
  • Familiarity with Microchip microcontrollers, microprocessors, wireless solutions, touch technology, FPGA products, tools, and documentation is an added advantage.
  • Excellent written and spoken English communication skills.
  • Ability to support customers in designing, developing, integrating, validating, and troubleshooting embedded wireless applications, and to deliver practical, creative solutions for resolving design and implementation challenges.
  • Collaborates effectively with customers, field teams, and internal engineering teams to resolve issues and meet design requirements. Influences technical direction, drives decisions, and provides leadership without direct authority.
  • Strong customer-facing communication, presentation, and interpersonal skills. Self-driven, detail-oriented, and capable of managing multiple priorities independently. Strong analytical, problem-solving, and organizational skills with effective project tracking and reporting.
  • Willingness and ability to travel domestically and internationally as needed to support customers, field teams, technical trainings, workshops, and strategic business opportunities.
Responsibilities
  • Act as a technical expert for embedded wireless controllers, SoCs, software frameworks, SDKs, and wireless connectivity solutions.
  • Provide advanced technical support to global customers, field application engineers, sales teams, and internal engineering teams for wireless embedded applications.
  • Develop innovative and scalable solutions to address complex customer design challenges, system-level issues, and product integration problems.
  • Lead the design, development, validation, and release of demo applications, reference designs, sample projects, and proof-of-concept solutions showcasing real-world use cases of Microchip wireless products.
  • Drive customer design-ins and design-wins by executing reference designs, customer projects, application notes, and technical demonstrations.
  • Collaborate closely with internal software, firmware, systems, silicon, validation, product marketing, and applications engineering teams to define, implement, optimize, and debug product features.
  • Analyze customer requirements and provide architectural guidance for embedded wireless applications involving Wi-Fi, Bluetooth/BLE, IEEE 802.15.4, and other relevant wireless technologies.
  • Validate, test, debug, and release SDKs, software framework packages, and application examples to ensure high quality, reliability, and ease of customer adoption.
  • Lead complex system-level debugging efforts involving embedded firmware, wireless protocol stacks, hardware interfaces, RF behavior, RTOS, and application-layer software.
  • Create high-quality technical resources such as Application notes, User guides, Training presentations, Instructional videos and Demo documentation
  • Develop and deliver technical training for customers, distributors, field engineers, and internal teams.
  • Mentor junior and mid-level engineers on embedded software development, wireless systems, debugging methodologies, customer communication, and applications engineering best practices.
  • Provide feedback to product development teams based on customer use cases, competitive analysis, field issues, and market requirements.
  • Work effectively in a global, cross-functional, and virtual team environment while independently managing multiple customer and internal priorities.
  • Travel as required to visit customers, support technical workshops, assist with on-site debugging, deliver product training, participate in design reviews, and support strategic customer engagements.
  • Use AI productivity tools such as Claude, GitHub Copilot, Microsoft Copilot, or similar platforms to improve efficiency in technical documentation, presentation creation, customer training material, and application note development.
  • Leverage AI-assisted development tools where appropriate to support firmware development, code generation, code review, debugging, test creation, and productivity improvement while ensuring compliance with company security, quality, and IP protection guidelines.
Desired Qualifications
  • Experience supporting global customers in a semiconductor, embedded systems, or wireless connectivity environment.
  • Experience developing production-quality firmware, SDK examples, reference applications, and customer-ready demos.
  • Experience with wireless certification, interoperability testing, regulatory considerations, or RF validation.
  • Experience with secure embedded systems, bootloaders, OTA firmware updates, low-power optimization, and cloud-connected embedded applications.
  • Experience using AI-assisted tools such as Claude, GitHub Copilot, Microsoft Copilot, ChatGPT, or similar tools for engineering productivity, documentation, training content, and firmware development support.
  • Ability to translate complex technical topics into clear customer-facing documentation, presentations, demonstrations, and training material.

About the company

Microchip Technology provides embedded system solutions by selling hardware components like microcontrollers, FPGAs, silicon carbide devices, and analog parts, along with software and development tools. Its products work as configurable silicon paired with software and toolchains that engineers use to design and implement embedded systems in domains such as automotive, industrial, consumer electronics, aerospace, and telecom. The company differentiates itself through a broad product portfolio, a strong education and support ecosystem (including Microchip University), and direct B2B sales and services that help customers develop and deploy solutions. Its goal is to be a leading provider of end-to-end embedded system solutions, generating revenue from hardware, software licenses, development tools, and related services.

Company Size

10,001+

Company Stage

IPO

Headquarters

Chandler, Arizona

Founded

1989

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Simplify's Take

What believers are saying

  • May 7, 2026 guidance implied June-quarter sales of $1.456 billion, up 35.3%.
  • Backlog and bookings strengthened into fiscal 2027, with management citing improved visibility.
  • Hyundai and Marelli partnerships expand Microchip's automotive Ethernet and display design wins.

What critics are saying

  • The Schuman ERISA settlement cost $13 million and proves legacy liabilities remain alive.
  • Capacity underutilization and inventory reserve charges still pressured gross margins in 2026.
  • If automotive customers standardize on Broadcom or NXP Ethernet, Microchip's differentiation shrinks.

What makes Microchip Technology unique

  • Microchip's September 29, 2026 10BASE-T1S portfolio targets zonal automotive Ethernet edge nodes.
  • Its September 16, 2026 roundup spans PIC32, mSiC, space, and PolarFire.
  • Microchip's 1.2V clock buffers, launched September 2026, simplify FPGA and SoC timing.

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Benefits

  • Health Insurance
  • 401(k) Retirement Plan
  • Stock Options
  • Performance Bonus
  • Employee Stock Purchase Plan

Company News

Associated Press
Oct 29th, 2026
Microchip adds EtherCAT and TSN networking to its power-efficient PolarFire FPGAs and SoCs

Microchip Technology has added EtherCAT and Time-Sensitive Networking (TSN) capabilities to its PolarFire FPGA and SoC devices. The aim is to help developers of industrial systems get real-time networking while cutting power use, keeping security and reducing complexity. Beckhoff Automation's EtherCAT IP works with both PolarFire FPGAs and SoCs, and supports connections at 10/100/1000 Mbps. Microchip's TSN IP runs on PolarFire SoCs and enables deterministic 1 Gbps Ethernet. PolarFire devices offer a secure, non-volatile design with instant-on operation, secure boot, and anti-tamper protection. Target uses include motion control, industrial robotics, factory automation, and aerospace and defence. "Industrial networks are becoming more intelligent, distributed and data driven as AI moves closer to the edge," said Shakeel Peera, vice president of Microchip's FPGA business unit.

Electronics Media
Oct 28th, 2026
New R&D proving ground strengthens future transport development.

New R&D proving ground strengthens future transport development. GÖPEL electronic and Microchip Technology collaborate to expand the ASA-ML ecosystem into Automotive Video Testing. October 28, 2026 ASA-ML Automotive Video Testing - GÖPEL electronic and Microchip Technology, a broadline supplier of semiconductors, are deepening their collaboration in the field of ASA Motion Link (ASA-ML). GÖPEL electronic is expanding its modular frame grabber/frame generator to include ASA-ML technology using SerDes chips from Microchip. The goal of the collaboration is to further expand the ecosystem surrounding ASA-ML and provide potential users with a seamless, fully functional environment - from the chip through test equipment to frame grabbers and generators. Medical electronics devices The open standard ASA-ML SerDes technology provides automakers and suppliers with an independent and high-performance technology for data connections. Thanks to its interoperability, the standard reduces dependence on individual vendors and facilitates the integration of different components. GÖPEL electronic and Microchip expect that their collaboration in the field of videobased test solutions using ASA-ML will further accelerate the adoption of the technology. Discover more Tech industry updates Automotive electronics components Artificial intelligence solutions "Expanding the ASA Motion Link ecosystem gives automakers and suppliers greater flexibility, interoperability and confidence so they can move faster from development to deployment," said Kevin So, vice president of Microchip's communications business unit. "Working with leading ecosystem partners such as GÖPEL electronic helps customers develop, test and validate multivendor ASA-ML solutions, supporting a more open approach to high-speed automotive connectivity." AI accelerator chips ASA-ML is an open standard for high-speed in-vehicle communication developed by the Automotive SerDes Alliance. The Alliance consists of automakers, suppliers, and chip manufacturers. The goal is to achieve cross-vendor interoperability of cameras, sensors, and other vehicle components while maintaining high data rates. ASA-ML supports asymmetric transmission of video, control, and payload data at data rates of up to 16 Gbit/s, thereby offering a scalable communication solution for modern vehicle architectures. Particularly for ADAS and future automated driving functions, the standard enables high-performance, secure, and interoperable networking of sensors and control units. With the high-performance Video Dragon frame grabber/frame generator from GÖPEL electronic, such ASA-ML components can also be reliably tested and simulated in the future. GÖPEL electronic uses the new ASA-ML chipsets from Microchip to develop these high-performance data transmission capabilities. Learn Engineering Discover more Electronics news subscription

Electronics Buzz
Oct 23rd, 2026
Microchip adds LX-820 Quartz Oscillator for Low Earth Orbit applications.

Microchip adds LX-820 Quartz Oscillator for Low Earth Orbit applications. October 23, 2026 Microchip Technology, announces the expansion of its L-Series of timing devices with the launch of its LX-820 Radiation-Tolerant Quartz Oscillator, designed for Low Earth Orbit (LEO) and other space applications. The L-Series portfolio provides satellite developers with a wide range of oscillator architectures to select from, each with varying frequency stability, phase noise, power and size, catering to different mission requirements. The L-Series is positioned between commercial off-the-shelf (COTS) oscillators and traditional high-reliability space products, combining commercial- or military-grade components with production inspection, electrical and thermal analysis and hybrid manufacturing. The L-Series oscillators have passed Total Ionizing Dose (TID) and Single-Event Latchup (SEL) testing as complete, functioning devices, with radiation tolerance up to 50 krad and SEL testing to 40 MeV·cm[2]/mg. Additionally, most L-Series products also use swept quartz to reduce radiation-induced frequency drift. The L-Series OCXOs incorporate ruggedized construction and four-point crystal mounts designed to survive launch and the intended mission profile. Designed to address two persistent challenges for satellite developers, the L-Series helps ease supply chain constraints while reducing budget pressure. Many timing solutions qualified for space environments have extended lead times and significant procurement costs. The L-Series is designed to provide a more accessible alternative, with many configurations available from stock or with lead times of less than 20 weeks. Additionally, the L-Series oscillators may lower overall program costs by reducing the need for the component pedigree, documentation requirements and inspection overhead that are typically associated with traditional high-reliability space-grade timing products. "Satellite developers should not have to choose between dependable precision timing and the cost and schedule requirements of their mission," said Randy Brudzinski, corporate vice president of Microchip's frequency and time systems business unit. "Our L-Series oscillators bring together the performance, radiation tolerance and supply availability our customers need to confidently deploy their New Space applications using a precision timing solution that helps reduce both schedule and mission risk." The new LX-820 is available in a compact 3.2 mm x 2.5 mm surface-mount package and is designed to operate across a wide temperature range from -55°C to 125°C. The rugged device is engineered to meet MIL-PRF-55310 Level B and provides +/-100 ppm performance. Additionally, the LX-820 supports CMOS output frequencies from 1.25 MHz to 135 MHz and low-voltage differential signaling (LVDS) output frequencies from 100 MHz to 250 Mhz. Modern satellite systems rely on highly accurate timing references to support communications, navigation, Earth observation, mapping and emerging lunar missions. As these applications can have different timing requirements, Microchip's L-Series encompasses crystal oscillators (XOs), temperature-compensated crystal oscillators (TCXOs), oven-controlled crystal oscillators (OCXOs) and a pulse-per-second (PPS) disciplined oscillator. These products allow developers to use compact XOs where size and broad frequency coverage are priorities, TCXOs where tighter temperature stability and lower power are needed, OCXOs for more demanding stability and phase-noise requirements, and a disciplined oscillator where PPS synchronization and holdovers are required.

Revista Española de Electrónica
Oct 23rd, 2026
Microchip adds the LX-820 quartz oscillator to its L-Series synchronization range developed for LEO applications.

Microchip adds the LX-820 quartz oscillator to its L-Series synchronization range developed for LEO applications. 23th October 2026 The company's L-Series synchronization devices have been designed as an intermediate proposition between conventional products and traditional space solutions, offering shorter lead times and competitive pricing. Microchip Technology today announced the expansion of its L-Series synchronization devices with the launch of its radiation-tolerant quartz oscillator LX-820Designed for low Earth orbit (LEO) and other space applications, the L-Series offers satellite developers a wide range of oscillator architectures, each with varying levels of frequency stability, phase noise, power, and size to suit different mission requirements. The L-Series is positioned between conventional oscillators and traditional high-reliability space products, hence the inclusion of commercial or military-grade components, as well as production inspection, electrical and thermal analysis, and hybrid manufacturing. L-Series oscillators have passed total ionization dose (TID) and single-event blocking (SEL) testing as fully functional devices with a radiation tolerance up to 50 krad and SEL testing up to 40 MeV·cm[2]/mg. Furthermore, most of the products in the The L-Series also utilizes purified quartz to reduce frequency drift caused by radiation. L-Series OCXOs are characterized by a rugged construction and four-point crystal mounting to withstand launch and the intended mission profile. The L-Series has been designed to address two persistent challenges for satellite developers by helping to overcome supply chain constraints and reducing budgetary pressures. Many space-grade timing solutions have experienced longer lead times and significantly higher procurement costs. The L-Series is designed to offer a more affordable alternative, with many configurations available from stock or with lead times of less than 20 weeks. Furthermore, L-Series oscillators can lower overall program costs by reducing the component suitability demonstration, documentation requirements, and inspection expenses typically associated with traditional, high-reliability, space-grade timing products. "Satellite developers shouldn't have to choose between precise, reliable timing on the one hand and cost and mission requirements on the other," said Randy Brudzinski, corporate vice president of Microchip's Frequency and Timing Systems business unit. "Our L-Series oscillators combine the performance, radiation tolerance, and availability our customers need to confidently deploy their new space applications using a precise timing solution that helps reduce program and mission risk." The new LX-820 comes in a compact 3,2 mm x 2,5 mm surface-mount package and is designed to operate over a wide temperature range of -55°C to 125°C. This rugged device is built to meet MIL-PRF-55310 Level B standards and achieves +/-100 ppm. Furthermore, the LX-820 supports CMOS output frequencies between 1,25 MHz and 135 MHz and LVDS (low-voltage differential signaling) output frequencies from 100 MHz to 250 MHz. Modern satellite systems require highly accurate timing references for communications, navigation, Earth observation, mapping, and the emerging lunar missions. These applications have different timing requirements; therefore, Microchip's L-Series utilizes XO (crystal oscillators), TCXO (temperature-compensated crystal oscillators), OCXO (oven-controlled crystal oscillators), and PPS (pulse-per-second) oscillators. These products allow developers to use compact XO oscillators when size and wide frequency coverage are priorities, TCXO when greater temperature stability and lower power consumption are needed, OCXO for more demanding stability and phase noise requirements, and a disciplined oscillator when the timing and hold capabilities of PPS are required. Microchip offers a wide range of clock and timing systems, from miniature oscillators and small plug-in timing server cards to atomic clocks and multirack timescale systems. A major contributor to world timekeeping, Microchip provides reliable, dependable, and resilient timing solutions. For more information, please visit [website address]. web page Microchip's clock and synchronization solutions. Prices and availability The LX-820 crystal oscillator and the remaining L-Series oscillators are now available in production quantities. For more information and to purchase, please contact a sales representative or authorized distributor from Microchip.

Electronics Media
Oct 23rd, 2026
AI accelerator chips market to cross USD 1 trillion by 2035.

AI accelerator chips market to cross USD 1 trillion by 2035. Microchip adds the LX-820 Quartz Oscillator to its L-Series timing portfolio developed for Low Earth Orbit applications. October 23, 2026 Microchip LX-820 Oscillator - Microchip Technology (Nasdaq: MCHP) today announces the expansion of its L-Series of timing devices with the launch of its LX-820 Radiation-Tolerant Quartz Oscillator, designed for Low Earth Orbit (LEO) and other space applications. The L-Series portfolio provides satellite developers with a wide range of oscillator architectures to select from, each with varying frequency stability, phase noise, power and size, catering to different mission requirements. Power management solutions The L-Series is positioned between commercial off-the-shelf (COTS) oscillators and traditional high-reliability space products, combining commercial- or military-grade components with production inspection, electrical and thermal analysis and hybrid manufacturing. The L-Series oscillators have passed Total Ionizing Dose (TID) and Single-Event Latchup (SEL) testing as complete, functioning devices, with radiation tolerance up to 50 krad and SEL testing to 40 MeV·cm[2]/mg. Additionally, most L-Series products also use swept quartz to reduce radiation-induced frequency drift. The L-Series OCXOs incorporate ruggedized construction and four-point crystal mounts designed to survive launch and the intended mission profile. Discover more Tech news India Products news updates Designed to address two persistent challenges for satellite developers, the L-Series helps ease supply chain constraints while reducing budget pressure. Many timing solutions qualified for space environments have extended lead times and significant procurement costs. The L-Series is designed to provide a more accessible alternative, with many configurations available from stock or with lead times of less than 20 weeks. Additionally, the L-Series oscillators may lower overall program costs by reducing the need for the component pedigree, documentation requirements and inspection overhead that are typically associated with traditional high-reliability space-grade timing products. "Satellite developers should not have to choose between dependable precision timing and the cost and schedule requirements of their mission," said Randy Brudzinski, corporate vice president of Microchip's frequency and time systems business unit. "Our L-Series oscillators bring together the performance, radiation tolerance and supply availability our customers need to confidently deploy their New Space applications using a precision timing solution that helps reduce both schedule and mission risk." The new LX-820 is available in a compact 3.2 mm x 2.5 mm surface-mount package and is designed to operate across a wide temperature range from -55°C to 125°C. The rugged device is engineered to meet MIL-PRF-55310 Level B and provides +/-100 ppm performance. Additionally, the LX-820 supports CMOS output frequencies from 1.25 MHz to 135 MHz and low-voltage differential signaling (LVDS) output frequencies from 100 MHz to 250 Mhz. Modern satellite systems rely on highly accurate timing references to support communications, navigation, Earth observation, mapping and emerging lunar missions. As these applications can have different timing requirements, Microchip's L-Series encompasses crystal oscillators (XOs), temperature-compensated crystal oscillators (TCXOs), oven-controlled crystal oscillators (OCXOs) and a pulse-per-second (PPS) disciplined oscillator. These products allow developers to use compact XOs where size and broad frequency coverage are priorities, TCXOs where tighter temperature stability and lower power are needed, OCXOs for more demanding stability and phase-noise requirements, and a disciplined oscillator where PPS synchronization and holdovers are required. Microchip offers an extensive portfolio of clock and timing systems, ranging from miniature component oscillators, to small plug-in timing server cards, to atomic clocks and multi-rack time scale systems. As a primary contributor to the world's time, Microchip's timing solutions are trusted, reliable and resilient. For more information, visit Microchip's clock and timing solutions webpage. Discover more Electronics news service