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HyperLight

Photonic integrated circuits for data centers

Senior Firmware R&D Engineer

Embedded EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • Strong experience in embedded firmware development using C/C++ and other languages.
  • Hands-on experience with CMIS and I2C/I3C protocols.
  • Experience with QSFP, OSFP, or similar form factors’ MSA specifications.
  • Experience working with DSP-based systems.
  • A solid understanding of high-speed communication systems above 400 Gbps.
  • Strong debugging skills in lab environments.

Responsibilities

  • Own firmware for optical transceiver reference designs built around TFLN modulators.
  • Design, develop, and maintain embedded firmware for IMDD and coherent optical transceivers.
  • Implement and optimize CMIS-compliant firmware stacks.
  • Develop drivers and communication stacks for I2C and I3C interfaces.
  • Interface with DSPs for signal processing, control, tuning, and monitoring.
  • Support high-speed optical modules above 1.6 Tbps.
  • Bring up hardware and debug issues.
  • Collaborate closely with hardware, optical, and system teams.
  • Develop internal CLI/GUI tools for diagnostics and configuration.
  • Ensure firmware reliability, performance, and standards compliance.
  • Contribute to system architecture and next-generation platform development.

Desired Qualifications

  • Experience with TFLN, silicon photonics, or other advanced modulator technologies.
  • A background in coherent detection or PAM4 systems.
  • Experience building reference designs.
  • Experience developing GUI tools, including with Python.
  • Familiarity with MDIO, SPI, or similar interfaces.
  • Experience with manufacturing test or automation.

About the Company

HyperLight

Photonic integrated circuits for data centers

HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.

Company size
51-200
Company stage
Series C
Total funding
$117M
Headquarters
Cambridge, MA
Founded
2018

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