NXP Semiconductors

Automotive semiconductors and secure embedded solutions

Process Technician

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeKuala Lumpur, Federal Territory of Kuala Lumpur, MalaysiaNo salary listedIn-person

About the Job

Requirements

Perform cleanliness checks, qualification activities, critical-dimension measurement and testing, and inspection of abnormal conditions and defects using cross-section analysis, X-ray, CSAM, EDX, and PATS.
Support critical-dimension buyoff for new pallets and peripherals.

Responsibilities

Validate the Sphere Attach reflow profile and perform OSP pre-treatment cleanliness checks at Yang Fa.
Run pre-treatment processes, including CZ testing, qualification activities, and running and monitoring engineering lots.
Run Sphere Attach processes, including CZ testing, qualification activities, and running and monitoring engineering lots.
Conduct Sphere Attach reflow and pre-treatment profile engineering studies.
Operate the ICOS system to track out lots and move or store lots into the next process.
Calculate machine UPH.

SA Reflow profile validation Pre Treatment Cleanliness check (OSP) at Yang Fa
Running Pre-Treatment (CZ testing,qualification activities,running & monitor engineering lots)
Running Sphere Attach (SA) (CZ testing,qualification activities,running & monitor engineering lots)
Run SA Reflow + Pre-Treatment Profile Engineering study
Running ICOS System track out/lot end move or store into next process
Check X-sec, X-ray, CSAM, EDX and PATS) - Abnormal condition & defects
New support tool critical dimension measurement / testing
New pallet/peripheral critical dimension buyoff
Machine UPH Calculation

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About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size: 10,001+
Company stage: IPO
Headquarters: Eindhoven, Netherlands
Founded: 2004

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