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Lumentum

Supplies photonic components for networks

Manufacturing Process Development Engineer-Wafer Cleaving Operation

Process EngineeringConfirmed live in the last 24 hours
Full-timeGreensboro, NC, USA$89.7k - $166kIn-person

About the Job

Requirements

  • A B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, or a related discipline.
  • At least 5 years of industrial experience supporting semiconductor or advanced manufacturing processes.

Responsibilities

  • Develop processes for wafer cleaving operations.
  • Own and sustain processing of thinned wafers through singulation and facet coating preparation.
  • Establish and maintain processes, specifications, statistical process control controls, failure modes and effects analyses, and out-of-control action plans.
  • Develop and sustain pick-and-place processes and equipment.
  • Develop and sustain bar stacking and unstacking to and from fixtures for facet processing.
  • Provide real-time engineering support for thinning operations in high-volume manufacturing.
  • Lead responses to process excursions, tool issues, and product-at-risk situations using structured problem-solving methods.
  • Investigate yield losses, defects, and reliability issues, and implement corrective and preventive actions.
  • Use statistical process control, design of experiments, and statistical analysis tools to identify root causes and improvement opportunities.

Desired Qualifications

  • Experience in semiconductor wafer fabrication.
  • Experience with wafer die singulation.
  • Experience with pick-and-place equipment and die-handling practices.
  • Familiarity with automation and advanced process control.
  • Proficiency with JMP, Excel, SQL, Python, or similar data tools.
  • Written and verbal communication skills, including technical documentation.

About the Company

Lumentum

Supplies photonic components for networks

Lumentum designs and manufactures optical and photonic components for data networks, data centers, sensing, and manufacturing, including diode lasers. Its devices convert electronic signals into light to enable high-speed data transmission and 3D sensing. The company differentiates itself with a broad, high-volume photonics platform that combines silicon photonics, laser diodes for 3D sensing, and integrated optical components for cloud, networking, and manufacturing, supporting large-scale deployment. Its goal is to increase the speed, flexibility, and efficiency of communication networks and sensing systems to meet growing cloud data traffic.

Company size
1,001-5,000
Company stage
IPO
Headquarters
San Jose, CA
Founded
2015

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