O

onsemi

Semiconductors for intelligent power and sensing

Atnpi ELT

Full-TimeUpdated on 10/14/2026
No salary listed
Entry
Master's
Jiangsu, China
In Person
Manufacturing & Process EngineeringManufacturing Engineering

About the job

Requirements
  • A master's degree and graduation within the past two years.
  • A positive, hardworking, and efficient work style.
  • Strong communication and teamwork skills.
  • Fluent spoken English and good English writing skills.
Responsibilities
  • Own assigned assembly and final-test processes, setting them up, validating them, identifying risks based on six-sigma capability and manufacturability, communicating with stakeholders, and mitigating risks to meet project quality, cost, yield, and delivery goals.
  • Support front-of-line, end-of-line, and final-test processes for new product introduction development projects and post-code-S activities.
  • Follow project Advanced Product Quality Planning phase requirements, provide documentation and line training, and respond to internal and external customers.
  • Advise development engineers, technical leads, and cross-functional teams on process and tooling design and process control to reduce potential impacts on quality, yield, cost, and delivery.
  • Attend design reviews to analyze and highlight risks that could affect mass production.
  • Review build diagrams for new and derivative products for compliance with design rules, manufacturability, and lessons learned.
  • Raise technical constraints that could significantly affect project quality, cost, yield, or delivery.
  • Secure process of record and bill of materials to meet new product introduction and manufacturing key performance indicator requirements.
  • Review, validate, and accept or reject design concepts from the technology group and package development for new product introduction from design review Advanced Product Quality Planning Phase Zero.
  • Review, validate, and accept or reject characterized process of record, including process flow, materials, and process parameters established by product engineering, based on manufacturing capability before line certification.
  • Ensure project documents, engineering reports, work instructions, out-of-control action plans, process parameters, bin limits, and tooling drawings are reviewed and uploaded in draft form to the database at each phase and finalized before product release.
  • Train manufacturing personnel, process engineers, technicians, operators, and designated trainers before line validation or certification.
  • Create mitigation plans with cross-functional teams to resolve issues identified during line certification, safe launch, and post-code-S monitoring for derivative devices.
  • Report and share closed-loop continuous improvement activities for new product introduction, including lessons learned, design-rule revisions, and Advanced Product Quality Planning deliverable updates.
  • Involve the process engineering team in post-code-S quality, yield, and cost activities to support a smooth handover through project transition.
  • Host buy-off and handover meetings with process engineering and cross-functional teams to present post-code-S monitoring results, including yield trends, failure modes and Pareto analysis, maverick material review board history, actions, line readiness review, risk management plan, and comparisons with line certification.
  • Hold material review board meetings when line shutdowns are caused or potentially caused by maverick events, quality change notices, out-of-control action plans, risk management plan failures, or potential failure modes in the owned process; provide reports and update associated control-database documentation.
  • Generate 8D reports for product quality assurance issues involving new products released within the previous two years and monitored under post-code-S activities.
  • Qualify automotive processes and personnel, collaborating with equipment engineering and quality assurance to qualify designated automotive equipment.

About the company

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial use. Its products include power management ICs and sensors that regulate energy and provide precise control signals for systems like EVs, ADAS, factory automation, robotics, and energy infrastructure. These chips work by efficiently handling electrical power, converting energy, and delivering sensing data and control outputs that enable safer, more capable machines. The company differentiates itself by specializing in intelligent power and sensing across both automotive and industrial markets and selling through direct OEM partnerships plus a global distributor network to support scalable deployment with energy efficiency at the core of its offerings.

Company Size

10,001+

Company Stage

IPO

Headquarters

Scottsdale, Arizona

Founded

1999

Get referred to onsemi

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • August 3, 2026 revenue grew 9% year over year to $1.604 billion.
  • AI data center revenue will more than double in 2026, management said August 3.
  • October 1, 2026 Synaptics deal adds connected compute, HMI, and $200 million synergies.

What critics are saying

  • January 2026 cut 650 jobs; June 2026 realignment still costs $25 million.
  • August 2026 priorities favored AI shipments over automotive; European auto revenue fell 2% sequentially.
  • Synaptics closing can fail if regulators, shareholders, or financing conditions slip before mid-2027.

What makes onsemi unique

  • onsemi owns silicon carbide, GaN, and sensing across automotive, industrial, and AI data centers.
  • September 16, 2026 Embedded Power Platform integrates power devices inside silicon wafers.
  • September 24, 2026 Valens collaboration extends onsemi’s imaging stack into MIPI A-PHY cameras.

Help us improve and share your feedback! Did you find this helpful?

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Paid Vacation

Paid Sick Leave

Paid Holidays

401(k) Retirement Plan

401(k) Company Match

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

1%
Yahoo Finance
Oct 14th, 2026
Sungrow adopts onsemi's SiC hybrid modules, lifting energy storage efficiency by 0.4%

Sungrow has adopted onsemi's EliteSiC silicon carbide (SiC) hybrid power module for its PowerTitan 3.0 energy storage platform, onsemi announced on October 14, 2026. The new design improves inverter-level efficiency by 0.4% over the previous generation and reaches peak efficiency above 99.3%. It supports power conversion units rated up to 450 kW, allowing higher-power battery storage deployments. According to onsemi's analysis, the 0.4% gain could save more than 475 MWh a year in a 100 MW installation. Sungrow expects to deliver 10 GWh of PowerTitan 3.0 across Europe in 2026. Industry forecasts say the battery energy storage market will more than double by 2030.

HookPhish
Oct 5th, 2026
Ransomware Group qilin hits: onsemi.

Ransomware Group qilin hits: onsemi. HookPhish team Target organization Onsemi onsemi.com Technology Summary. In the latest cybersecurity news, Onsemi - an organization based in US - has fallen victim to a ransomware attack conducted by the group qilin. This data breach, discovered on Oct 5, 2026, 13:15 UTC, underscores the increasing need for proactive cybersecurity defenses as HookPhish continue through 2026. Incident report. | Target Organization | Onsemi | | Threat Group | qilin | | Summary | N/A | | Date of Breach | Oct 5, 2026, 13:14 UTC | | Discovery Date | Oct 5, 2026, 13:15 UTC | | Region | US | | Target Domain | www.onsemi.com | | Business Sector | Technology | How to reduce your ransomware risk. Most ransomware intrusions start with a stolen password or a phishing email. A few proactive steps sharply cut your exposure: * awareness training - close the gap attackers exploit. * keep watch on the dark web - close the gap attackers exploit. Disclaimer. HookPhish does not engage in the exfiltration, downloading, taking, hosting, viewing, reposting, or disclosure of any stolen information. All breach data reported here is sourced from publicly available threat intelligence feeds for awareness purposes only.

Banca di Bologna
Oct 4th, 2026
Wall street braces for divergent brazil election outcomes.

Wall street braces for divergent brazil election outcomes. BankBit Editorials 16 hours ago 35 Key deals this week underscore corporate activity across multiple sectors, with semiconductor supplier Onsemi finalizing a $2.3 billion acquisition of a rival's wafer fab, Mattel closing a $1.1 billion licensing pact for a new line of STEM toys, Nebius sealing a cloud-infrastructure partnership valued at $800 million, and Advanced Micro Devices announcing a strategic joint venture with a European chipmaker to accelerate AI chip production. In the biotech arena, Agenus reported an estimated 48 % three-year survival rate for recurrent ovarian cancer using its BOT+BAL therapy at the IGCS 2026 conference, sending AGEN shares gaining momentum as analysts revise price targets upward. Indian market strategists highlighted Nifty's key support at 22,600, noting that PB Fintech, Infosys, and TCS are positioning their Q2 strategies around robust digital adoption and cloud migration trends, while anecdotal commentary from Apple's co-founder Steve Wozniak about his early $50 salary and HP rejections added a human touch to the tech narrative, reminding investors of the sector's pioneering roots. Meanwhile, warnings about fake job postings exposing seekers to identity theft have heightened regulatory scrutiny, prompting calls for stricter verification protocols across hiring platforms. Investor confidence remains fragile, with risk gauges hovering near 52 % volatility and liquidity tightening across emerging equities. This Financial Briefing was curated and fact-checked by BankBit Editorial Team. It appeared first on BankB.it. Follow its Editorial Feed RSS Feed BankBit shares this Content always with CC License

Yahoo Finance
Oct 2nd, 2026
Analog chip makers Texas Instruments, Analog Devices, and ON Semiconductor capitalise on AI data centre boom

Texas Instruments, Analog Devices, and ON Semiconductor are capitalising on growing demand for analog chips in AI infrastructure. These chips manage power flows and convert real-world inputs into digital data, making them essential for data center operations. Texas Instruments reported 23% year-over-year revenue growth in Q2, with its analog segment up 29%. The company cited continued growth in industrial, data center, and automotive segments. Analog Devices saw 40% year-over-year revenue growth in fiscal 2026 Q3, with net income more than doubling. The company maintains a 39% free cash flow margin and has returned over $24 billion to shareholders in the past decade. ON Semiconductor expects AI data center revenue to more than double in 2026. The company is acquiring Synaptics to strengthen its position in physical AI, expanding its addressable market to $243 billion by 2030.

IT Business Today
Sep 24th, 2026
Valens, onsemi develop cost-optimized A-PHY sensors.

Valens, onsemi develop cost-optimized A-PHY sensors. Last updated: September 24, 2026 11:02 am Valens Semiconductor has announced a collaboration with onsemi. Valens Semiconductor and onsemi will create a cost-optimized integrated sensor solution, for mass-produced 3-megapixel camera applications. I think this partnership will help automakers and Tier-1 suppliers adopt MIPI A-PHY widely. Under the agreement Valens Semiconductor will work with onsemi to develop a cost-optimized A-PHY solution that can be integrated with onsemi's image sensors. Valens Semiconductor and onsemi will combine their expertise in connectivity and automotive imaging technology to further develop the A-PHY ecosystem. Valens CEO Yoram Salinger said the collaboration represents an important step for Valens, MIPI A-PHY, and the automotive industry. He noted that the integrated cost-optimized 3MP solution will complement Valens' existing products and enable A-PHY to address a wider range of applications. He also highlighted the significance of working with onsemi as a major A-PHY semiconductor supplier and providing automakers with a choice of products from multiple suppliers. Ahmed Salem, Vice President and General Manager of onsemi's Intelligent Sensing Group, said interest from automakers and partners indicates the potential business opportunity associated with MIPI A-PHY. As automotive imaging systems become larger and more sophisticated, customers are seeking solutions that simplify designs without compromising performance. Through the collaboration, the companies aim to support simpler camera architectures that reduce component counts while complying with industry standards, making advanced vision systems easier to implement. Automotive image sensors commonly use resolutions ranging from 1MP to 3MP. As automakers move toward higher-resolution systems, 3MP solutions are positioned to address both the existing market and growing upgrade demand. The companies view this segment as an important opportunity for bringing MIPI A-PHY into mainstream mass-production vehicles. MIPI A-PHY is a high-speed sensor connectivity standard developed specifically for the automotive industry. Valens says it was the first company to offer chipsets compliant with the A-PHY standard and has already secured design wins from multiple automakers. Valens Semiconductor develops high-speed connectivity semiconductor solutions used across applications including advanced audio and video equipment, next-generation videoconferencing systems, ADAS, and autonomous driving. Its technology contributes to industry standards including HDBaseT and MIPI A-PHY. Through the new collaboration, Valens and onsemi will focus on developing an integrated, cost-optimized 3MP automotive camera solution designed to support broader adoption of MIPI A-PHY in mass-production vehicles.