Technical Director

The Global Field Group (GFG) at Applied Materials is the frontline organization responsible for installing, sustaining, and optimizing the industry’s most advanced semiconductor manufacturing equipment at customer sites around the world. GFG partners closely with customers to ensure tools operate at peak performance, enabling reliable,high-volume production of leading-edge chips. Through a combination of deep technical expertise, rapid problem solving, and close collaboration with engineering and product teams, GFG plays a critical role in turning innovation intoreal-world manufacturing success.

As Technical Director for a key logic account, you areone ofApplied'ssenior technical leaderson that account. You work directly with the customer to identify their highest-impact yield, performance, and cost challenges, build multi-product technology programs to solve them, and carry what you learn back intoApplied'sproduct roadmaps.

Why Join Us

• Pioneering Innovation:Work ontheprocess technologies behindthe industry's most advanced logic nodes, from early development through high-volume manufacturing.

• Collaborative Environment: Work in a dynamic, collaborative culture that values innovation, encourages creativity, and fosters professional growth.

• Account Ownership: Serve as the senior technical voice on one ofApplied'smost strategic logic accounts, with direct visibility to customer and internal executives, influence over both the customer's device roadmap andApplied'sproduct roadmap, and a clear path to broader technical leadership.

Key Responsibilities

• Lead account-wide strategic initiatives for device yield, performance, and cost improvement. These initiatives will involve bundling technology benefits across multiple Applied Materials product areas — deposition, etch, anneal, and metrology.

• Interface with customers across these process areas at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies.

• Identify technology inflections through customer engagement and articulate them to internal product and engineering teams to shape product roadmaps and mid- to long-term development priorities.

• Ensure alignment between internal groups (commercial, technical, and operations) for key initiatives, driving consensus and outcomes through influence.

• Own timelines, milestones, risk management, and deliverables for thestrategic initiatives and CIPs you lead.

• Act as the senior technical authority for the account — supporting internal teams on deep technical issues (integration or unit process), mentoring engineers, and fostering a collaborative, high-performance environment across cross-functionalteams.Thisis a senior individual-contributor role: influence and technical authority are exercised across cross-functional teams rather than through direct reports, with potential for the scope to expand to people leadership over time.

Qualifications

Education:

• B.S. in an engineering discipline, or M.S. in Physics, Chemistry, or an equivalent STEM field.Advanced degree (M.S. or Ph.D.) preferred.

Experience:

• 12+ years of experience in the wafer fab or semiconductor capital equipmentindustry.

• 15+ years preferred in semiconductor capital equipment process engineering, wafer fab process engineering, or wafer fab process integration within a technology development organization.

• Demonstrated experience leading complex, cross-functional technical programs and influencing outcomes across engineering, commercial, and operations teams.

• Proven experience partnering with customers at development and high-volume-manufacturing sites, including presenting to and building trust with senior technical and executive stakeholders.

Technical Expertise:

• Recognized, in-depth technical expertise inone or more of the following:

• Processengineering for a semiconductor process technology (deposition, etch, anneal, or metrology).

• Processintegration of one or more segments ofa leading logic or advanced packaging process flow.

• Strong understanding of leading logic technologies and process flows; advanced packaging experience preferred.

• Experience bundling or integrating value across multiple process technologies (e.g., deposition, etch, anneal, metrology) to solve device-level yield, performance, or cost problems.

Skills & Competencies:

• Ability to articulate complex technical concepts and value propositions clearly to both technical and business audiences.

• Experience building and delivering presentations to senior executives.

• Ability to lead and influence across organizational boundaries without direct authority.

• Strong organizational and project management skills.

• Demonstrated ability to manage multiple priorities in a dynamic environment.

Location & Travel

• Location: Hillsboro, OR (on-site).

• Travel:Less than20%, including domestic and international travel to customer sites.